Mitsubishi Electric Corporation

Mitsubishi Corporation

Shuzo Akiyama

Takayuki Kifuku

Tsutomu Tominaga

Tadayuki Fujimoto

Masahiro Kimata

Masaaki Tanigawa

The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.

Electronic control apparatus

An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.

An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.

Provided is an electronic control device, including: a housing () which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink () attached to one of the end portions of the housing (); a power device () provided to the heat sink (); a circuit board () which is provided so as to be opposed to the heat sink () and formed with an electronic circuit including a control circuit for controlling the power device (); and a plurality of first conductive plates () held in the housing (), for electrically connecting the circuit board () with the power device (), in which each of the plurality of first conductive plates () includes a press fit terminal () press-fitted into a through hole () formed in the circuit board () to be bonded to the circuit board () on a surface opposed to the circuit board () and to be bonded to respective terminals of the power device () on a surface opposed to the heat sink (). Accordingly, an electronic control device whose size and cost are reduced and whose electrical connection reliability is improved is obtained.

Electronic control device and method of manufacturing electronic control device

An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.

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Tokyo, Japan

Shuzo Akiyama