Huawei Digital Power Technologies Co., Ltd.

Shuyi Lv

Lei Shi

Dong Chen

Yunfeng Liu

Wei Li

Yunyu Tang

Pengcheng Zhang

Fenglong Lu

A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.

Packaged device, packaged module, and power conversion device

Growing community of inventors

Shanghai, China

Shuyi Lv