Mitsubishi Gas Chemical Company, Inc.

Shuya Suenaga

Takashi Yamamoto

Daisuke Ohno

Yuuki Sato

Masayuki Daito

Yohei Abiko

Shinji Sekiguchi

Kazuaki Mukasa

Aoi Daito

Teruhisa Matsumaru

Ryuichiro Kawai

Hiroaki Oka

Tomohiro Hariu

Yasushi Miki

Takafumi Takada

A method for controlling a polyimide backbone structure, including: in preparation of a polyimide through reaction of a diamine component and (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in an organic solvent containing an aprotic amide solvent and a lactone solvent, adjusting one or more of reaction conditions of a mass ratio of the aprotic amide solvent and the lactone solvent, a reaction temperature, a reaction time, and an amount of the aprotic amide solvent, so as to convert a cis-structure derived from the (1S,2R,4S,5R)-cyclohexanetetracarboxylic dianhydride in the formed polyimide to a trans-structure derived from (1R,2S,4S,5R)-cyclohexanetetracarboxylic dianhydride corresponding to the reaction conditions, thereby controlling a proportion of the trans-structure.

Method for controlling polyimide backbone structure and method for producing polyimide

The present invention is directed to a polyimide resin comprising a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A contains a structural unit (A-1) derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, and the structural unit B contains a structural unit derived from an aliphatic diamine, a polyimide resin composition comprising the polyimide resin and inorganic nanoparticles, and a polyimide film comprising the polyimide resin or the polyimide resin composition. Provided are a polyimide resin and a polyimide resin composition, each of which can form a film having not only a heat resistance, and colorlessness and transparency but also low water absorption properties, and a polyimide film.

Polyimide resin, polyimide resin composition, and polyimide film

Disclosed are a polyimide resin containing a structural unit represented by the following formula (1-1), and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 &#x3bc;m. Rand Rin the formula (1-1) each independently represent any group of the following formulae (i) to (iv), Rand Rin the formula (1-2) each independently represent a group of the following formula (i) or formula (ii), and in these formulae, * bonds to the carbon with * in the formula (1-1) and the formula (1-2) and ** bonds to the carbon with ** in the formula (1-1) and the formula (1-2). A polyimide resin capable of forming a polyimide film excellent in transparency and having a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion are provided. 

Polyimide resin and polyimide film

An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups.  In Formula (b-1), Qand Qare each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.

Asymmetric membrane

Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40.

Polyimide resin composition

A polyimide resin contains repeating structural units represented by formulas (1) and (2), wherein the content of the repeating structural unit represented by formula (2) relative to the total of the repeating structural unit represented by formula (1) and the repeating structural unit represented by formula (2) falls within a specific range and the content of the divalent group represented by the following structural formula (B1) falls within a specific range: Xrepresents a tetravalent group containing an alicyclic hydrocarbon structure and having a carbon number of from 4 to 22. Xrepresents a tetravalent group containing an aromatic ring and having a carbon number of from 6 to 22. Rand Reach independently represent a divalent organic group, and the content of the divalent group represented by the following structural formula (B1) relative to the total of Rand Ris from 80 to 100 mol %: 

Polyimide resin

The present invention provides a process for producing a transparent heat-resistant gas-barrier film capable of exhibiting a good gas-barrier property and maintaining good properties even after heat-treated at a temperature of 250&#xb0; C. or higher, in a simple manner at low costs without need of a large size facility and a number of steps. The process for producing a transparent heat-resistant gas-barrier film according to the present invention includes the steps of coating a polysilazane-containing solution onto at least one surface of a transparent polyimide film formed of a polyimide containing a specific repeated unit; and calcining the coated solution at a temperature of 180&#xb0; C. or higher to laminate a silicon oxide layer obtained by the calcination on the transparent polyimide film.

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Kanagawa, Japan

Shuya Suenaga