Nuctech Company Limited

Tsinghua University

Chengdu Boe Optoelectronics Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Shenzhen Taner Environmental Storage and Transportation Technology Co., Ltd.

Shuwei Li

Qingjun Zhang

Yuanjing Li

Ziran Zhao

Xiang Zou

Wenjian Zhang

Weibin Zhu

Yinong Liu

Yongqiang Wang

Huishao He

Junxiao Wang

Bozhen Zhao

Zhiqiang Chen

Yaohong Liu

Qiang Wang

Hongqiang Luo

Yulan Li

Kwanggyun Jang

Zhude Dai

Lifeng Sun

Nianming Jiang

Xiaolin Zhao

Qingwen Miao

Yi Wang

Kejun Kang

Jianmin Li

Chunguang Zong

Jianping Chang

Hang Min

Yanchun Wang

Nan Bai

Shuqing Zhao

Wenhuan Gao

Xiaofeng Luo

Jaeseung Kim

Jianhua Li

Jungyoup Suk

Ciyi Qingsha

A touch display driving apparatus, a method, and a touch display apparatus are provided. The touch display driving apparatus includes: an analog front end, a timing controller, and a master oscillator, herein, the master oscillator is connected with a signal input and output end, the analog front end, and the timing controller, respectively, and is configured to provide a first output signal to the analog front end and provide a second output signal to the timing controller, under controlling of the signal input and output end.

Touch display driving apparatus, method and touch display apparatus

A touch display driving apparatus, a method, and a touch display apparatus are provided. The touch display driving apparatus is connected with a touch display panel; and the touch display driving apparatus includes a controller and a memory connected with the controller, wherein the memory is configured to store display data and touch data; and the controller is configured to perform a first reading and writing operation for reading and writing display data in the memory, when the touch display panel is in a display working period; or, perform a second reading and writing operation for reading and writing touch data in the memory, when the touch display panel is in a touch working period.

The present disclosure provides a dual-energy detection apparatus and method. The dual-energy detection apparatus includes an X-ray source configured to send a first X-ray beam to an object to be measured; a scintillation detector configured to work in an integration mode, and receive a second X-ray beam penetrating through the object to be measured to generate a first electrical signal; a Cherenkov detector configured to be located behind the scintillation detector, work in a counting mode, and receive a third X-ray beam penetrating through the scintillation detector to generate a second electrical signal; and a processor configured to output image, thickness and material information of the object to be measured according to the first electrical signal and the second electrical signal. The dual-energy detection method provided by the present disclosure may acquire an image of the object to be measured that is clearer and contains more information.

Dual-energy detection apparatus and method thereof

The present disclosure discloses an afterglow detection device and an afterglow detection method. The afterglow detection device comprises: an X-ray tube for emitting an X-ray beam; a first reading circuit for receiving a first detected signal from a to-be-detected detector to form and output a first measurement signal according to the first detected signal, the to-be-detected detector being connected to the first reading circuit and disposed on a beam-out side of the X-ray tube to receive radiation of the X-ray beam and outputting the first detected signal to the first reading circuit at the time of detection; a residual ray detector disposed on a beam-out side of the X-ray tube; a second reading circuit connected to the residual ray detector for receiving a second detected signal from the residual ray detector to form and output a second measurement signal according to the second detected signal.

Afterglow detection device and afterglow detection method

The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.

Packaging structures for metallic bonding based opto-electronic device and manufacturing methods thereof

The present invention discloses an X-ray beam intensity monitoring device and an X-ray inspection system. The X-ray beam intensity monitoring device comprises an intensity detecting module and a data processing module, wherein the intensity detecting module is adopted to be irradiated by the X-ray beam and send a detecting signal, the data processing module is coupled with the intensity detecting module to receive the detecting signal and output an X-ray beam intensity monitoring signal, wherein the X-ray beam intensity monitoring signal includes a dose monitoring signal for the X-ray beam and a brightness correction signal for correcting signal values of the X-ray beam. The X-ray beam intensity monitoring device can simultaneously perform dose monitoring and brightness monitoring, thereby improving the service efficiency of the X-ray beam intensity monitoring device. Moreover, the monitoring result of the X-ray beam intensity can be more accurate and reliable.

X-ray beam intensity monitoring device and X-ray inspection

A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. The outer encapsulation layer is provided on the outer surface of the base.

Radiation detector assembly and method of making the same

The present application relates to a dual-energy detection method, system and apparatus. The apparatus includes: a first pixel detector array proximal to a ray source, configured to detect ray source photons having relatively low energy; and a second pixel detector array distal from the ray source, configured to detect ray source photons having relatively high energy; wherein the first pixel detector array includes a plurality of rows of first pixel detectors, the first pixel detector including a first sensitive medium, a first photosensitive device, a first incidence plane, and a first window; the second pixel detector array includes a single row of second pixel detectors, the second pixel detector including a second sensitive medium, a second photosensitive device, a second incidence plane, and a second window; and each of the second pixel detectors has the same pixel area as corresponding plurality of first pixel detectors thereof.

Dual-energy detection apparatus, system and method

The present application relates to a dual energy detector and a radiation inspection system. The dual energy detector comprises: a detector module mount and a plurality of detector modules. The detector module includes a higher energy detector array and a lower energy detector array, which are juxtaposedly provided on said detector module mount to be independently irradiated. The present application may simplify the arrangement of the photodiodes and printed circuit boards to which the higher and lower energy detector arrays are connected, such that necessary thickness dimension of the detector module mount is reduced, thereby facilitating the installation and use of the dual energy detector of the present application. On the other hand, the radiation beam in the present application may be independently irradiated to the higher and lower energy detector arrays juxtaposed to each other, which reduces to certain extent the mutual restriction during selection of the higher and lower energy detector arrays.

Dual energy detector and radiation inspection system

This disclosure provides a radiation detection apparatus and a method, a data processing method and a processor, which relates to the field of radiation detection technology. Wherein, the radiation detection apparatus of this disclosure comprises: a radiation detector which generates an electrical signal by interacting with X-rays; an Analog-to-Digital Converter (ADC) which is coupled to the radiation detector and transmits the electrical signal to a waveform data; and a data processor which receives the waveform data from the ADC, determines the number of single photon signals according to the waveform data, and determines whether an integral signal and/or a count signal of the waveform data will be used for imaging according to the number of the single photon signals.

Radiation detection apparatus and method, data processing method and processor

The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.

Safety inspection detector and goods safety inspection system comprising sealing material filled between an opening on a housing and the end portion of a detection module

Methods and apparatuses for measuring an effective atomic number of an object are disclosed. The apparatus includes: a ray source configured to product a first X-ray beam having a first energy and a second X-ray beam having a second energy; a Cherenkov detector configured to receive the first X-ray beam and the second X-ray beam that pass through an object under detection, and to generate a first detection value and a second detection value; and a data processing device configured to obtain an effective atomic number of the object based on the first detection value and the second detection value. The Cherenkov detector can eliminate disturbance of X-rays below certain energy threshold with respect to the object identification, and thus accuracy can be improved for object identification.

Methods and apparatuses for measuring effective atomic number of an object

Disclosed is a multi-array detector module structure pertaining to the technical field of radiation detecting. The multi-array detector module structure comprises a casing, a bottom plate to which a bottom end of the casing is fixedly connected, and a multi-array detector composed of a plurality of detectors, wherein a mounting frame is disposed on the bottom plate, and the mounting frame includes an upper plate and a lower plate. The multi-array detector comprises two rows of peripheral detector arrays fixed to the upper plate and the lower plate of the mounting frame, respectively, and at least one row of middle detector array disposed between the two rows of peripheral detector arrays and fixed to the same. Heavy metal sheets are provided between respective detector arrays in respective rows of detector arrays, for reducing cross talk. Furthermore, heavy metal plates are provided between the two rows of peripheral detector arrays and the upper plate and the lower plate of the mounting frame, respectively, for reducing diffusion. Compared with the prior art, the present invention can achieve remarkable economic benefit by slightly improving the structure with low investment. The present invention further has advantages of a simple structure and convenience in installation and maintenance.

Multi-array detector module structure for radiation imaging

Disclosed is a dual array detector module adapted to radiation-imaging, comprising: a first detector array consisting of a plurality of first detectors and arranged on a first surface of a heavy metal plate; a second detector array consisting of a plurality of second detectors and arranged on a second surface of the heavy metal plate opposite to the first surface; and a mounting frame, in which the first detector away and the second detector array arranged on the first and second surfaces of the heavy metal plate respectively are mounted in the mounting frame, a housing which has a substantially elbow shape in cross-section, wherein an electronic circuit board having an output terminal and an input terminal is disposed inside the housing, in which the input terminal of the electronic circuit board is connected to signal output terminals of the first and second detector arrays and the output terminal of the electronic circuit board is connected to a socket mounted on the housing.

Dual-array detector module

Growing community of inventors

Beijing, China

Shuwei Li