Fujitsu Corporation

Shuuhei Fujita

Hitoshi Yokemura

Masaru Sugie

Shinichirou Kouno

Takayuki Ashida

Hiroyuki Otaguro

Yasushi Yui

Shinichirou Okamoto

Hidenao Nakajima

Yoshimi Watanabe

An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor device on the circuit board, the conductive frame being fitted in the recess.

Electronic apparatus having integrated shielding film

A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

Circuit board packaging structure

Growing community of inventors

Kawasaki, Japan

Shuuhei Fujita