C.uyemura Co., Ltd.

Shushi Morimoto

Hisamitsu Yamamoto

Teruyuki Hotta

Takahiro Ishizaki

The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill () to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole () formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (), to form the via fill (), and a step of forming a wiring pattern to form electroless plating metallic film () serving as the wiring pattern onto a substrate where the via fill () is formed.

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Osaka, Japan

Shushi Morimoto