Lenovo (singapore) Pte. Ltd.

Shusaku Tomizawa

Masahiro Kitamura

Hajime Yoshizawa

Akinori Uchino

Junki Hashiba

Hao-Yu Wang

Takuroh Kamimura

Atsushi Ohyama

Takateru Adachi

Qianyi Lu

Kengo Sano

A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.

Vapor chamber and electronic apparatus

A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.

Cooling module and electronic apparatus

An electronic apparatus includes: a chassis; a heating element; a cooling module having a fan, a heat sink, and a heat transport device, the cooling module being configured to cool the heating element. The heat sink includes: a base plate; a plurality of fins standing from the base plate and placed with a gap between the fins to define an air channel through which air from the air outlet flows; and an inclined plate dividing the air channel in two stages in the standing direction of the fins and being gradually inclined from upstream to downstream of the air channel.

Electronic apparatus, cooling module, and heat sink

A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.

Electronic apparatus

An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.

Electronic apparatus, cooling device, and method for manufacturing cooling device

An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatusincludes a chassishaving an electronic componentarranged therein, a heat sinkwhich is provided in the chassisand absorbs heat generated from the electronic componentwhen its one surfaceis arranged to enable conduction of the heat from the electronic component, and a heat conducting sheetwhich is arranged in the chassis, closely arranged on the other surfaceon the side opposite to the one surfaceof the heat sink, has an outer shape area larger than an outer shape area of the heat sink, and extends to the outside of an outer shape of the heat sink

Growing community of inventors

Yokohama, Japan

Shusaku Tomizawa