Shanghai Huali Microelectronics Corporation

Shuqing Duan

Cheng Wu

Jinde Gao

The present application discloses a method for locating an open circuit failure point of a test structure, which includes the following steps: step: providing a sample formed with a test structure, a first metal layer pattern and a second metal layer pattern of the test structure forming a series resistor structure through each via; step: performing a first active voltage contrast test to the sample to show an open circuit point and making a first scratch mark at an adjacent position of the open circuit point; step: forming a coating mark at the first scratch mark on the sample; step: performing a second active voltage contrast test to the sample to show the open circuit point and locating a relative position of the open circuit point by using a position of the coating mark as a reference position.

Growing community of inventors

Shanghai, China

Shuqing Duan