Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Beijing Boe Technology Co., Ltd.

Beijing Boe Chatani Electronics Co., Ltd.

Shuqian Dou

Xiaoliang Fu

Ting Tian

Zhiqiang Fan

Dayong Zhou

Liguang Deng

Dong Zhang

Yongjie Han

Yu Liu

Ming Zhai

Yawen Zhang

Youcai Yang

Zhongjun Wang

Xiaoping Zhang

Jian Ren

Litao Fan

Yanjun Liu

Site Cai

Jia Meng

Xiaojuan Gao

Siqi Yin

Taesung Kang

Jinge Zhao

Jian Zhang

Jun Cheng

Yujie Liu

Hyungkyu Kim

Jian Bai

Yangli Zheng

Tao Jia

Pan Guo

Yaodong Wang

Luo Zhang

Bangcan Xue

Yingxue Yu

Wenfeng Jin

Zhenguo Zhou

Zhehua Long

Xuewen Cao

Meijuan An

Mengxing Xu

Xianfeng Mao

Zheran Li

Dongxu Yang

Dong Yang

The disclosure provides an array substrate, a display panel and a displaying device, relating to the technical field of display ambient light. The array substrate has an active area and a peripheral area located on at least one side of the active area. The array substrate comprises a brightness detection module and a reference module. The brightness detection module is arranged in the peripheral area, comprising at least one first thin-film transistor. The brightness detection module is configured to receive ambient light, generate an ambient light brightness detecting current signal in response to the ambient light and output the ambient light brightness detecting current signal. The reference module is arranged in the peripheral area, comprising at least one second thin-film transistor. The reference module is configured to, in a dark state without ambient light, generate and output a reference current signal.

Array substrate, display panel and displaying device

A rotational speed sensor, a manufacturing method thereof, a driving method thereof, and an electronic device are provided. The rotational speed sensor includes liquid crystal cell, rotational speed sensing module and rotational speed determining module; rotational speed sensing module is configured to convert rotational speed into voltage signal and apply voltage signal to liquid crystal cell; and at least a part of optical signal propagation module of rotational speed determining module is located in liquid crystal cell. Spectrum drift time of optical signal propagated in optical signal propagation module is variable as refractive index of liquid crystal molecules in liquid crystal cell changes; optical signal transmitting module in rotational speed determining module transmits optical signal to optical signal propagation module; optical signal receiving module in rotational speed determining module receives optical signal propagated by optical signal propagation module and analyzes spectrum to determine rotational speed.

Rotational speed sensor, manufacturing method thereof, driving method thereof and electronic device

A method for driving display panel includes: for one of adjacent two frames of displayed images, when scanning odd-numbered row of sub-pixels, inputting data signals to the data lines coupled to the data selector in first order by a data selector; when scanning even-numbered row of sub-pixels, inputting data signals to the data lines coupled to the data selector in second order by the data selector; first and second orders each represents an order of inputting data signals to the data lines; first order is opposite to second order; for the other of the adjacent two frames of displayed images, when scanning odd-numbered row of sub-pixels, inputting data signals to the data lines coupled to the data selector in second order by the data selector; when scanning even-numbered row of sub-pixels, inputting data signals to the data lines coupled to the data selector in first order by the data selector.

Method for driving display panel, display panel and display device

This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Light-emitting diode chip, method for fabricating the same, backlight module, and display device

A finger exoskeleton robot includes a support plate, at least one finger mechanism, and a temperature control system. Each of the finger mechanisms includes a plurality of finger sleeves and joint drivers. The sleeves of the finger mechanism are sequentially arranged at a distance and configured to be correspondingly worn on a plurality of knuckles of the user's fingers. Every two finger sleeves adjacent to each other of the finger mechanism are connected by one joint driver. The support plate and one of the finger sleeves closest to the support plate are connected by one joint driver. The joint driver is switched between a flat state and a curved state when the temperature of the joint drivers is higher than or lower than a phase change temperature value. A temperature control system is electrically connected to the respective joint drives and respectively controls the temperature of the joint drivers.

Finger exoskeleton robot

The disclosure discloses an acceleration sensor, where the acceleration sensor comprises: a housing, and a mass block in the housing and connected with the housing via at least two hanging beams, where an auxiliary buffer component is further provided between the mass block and a bottom surface of the housing, and an elastic coefficient of the auxiliary buffer component decreases as force applied thereon increases.

Acceleration sensor

A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.

Method for manufacturing micro light-emitting diode array substrate

The present application provides a fingerprint sensor. The fingerprint sensor includes an array of a plurality of optical fibers. Each of the plurality of optical fibers has a first end and second end opposite to the first end. Each of the plurality of optical fibers is configured to allow an incident light to enter into the second end and an exit light to exit from the second end. Each of the plurality of optical fibers includes a fiber core; a fiber Bragg grating in the fiber core; and a reflective film on the first end.

Fingerprint sensor, display apparatus, method of detecting a fingerprint, and method of fabricating a fingerprint sensor

A device for fingerprint recognition, a manufacturing method therefor, and an electronic apparatus are provided. The method includes: forming fingerprint recognition units in multiple independent preset regions of a substrate, where the fingerprint recognition units each include a fingerprint recognition component and a light emitting component; partitioning the substrate along boundaries of the preset regions to separate the fingerprint recognition units from each other; and coupling the fingerprint recognition units after partition with corresponding control circuits, to make the fingerprint recognition component and the light emitting component of each fingerprint recognition unit be electrically connected to a corresponding control circuit coupled with the each fingerprint recognition unit. The fingerprint recognition unit and the control circuit coupled with each other serve together as the device for fingerprint recognition. The method is for manufacturing the device for fingerprint recognition.

Device for fingerprint recognition, manufacturing method therefor, and electronic apparatus

A light emitting diode device, an array substrate and a display device. The light emitting diode device includes a substrate, a first sub-light emitting unit disposed on the substrate, and a second sub-light emitting unit disposed on a side of the first sub-light emitting unit away from the substrate. The first sub-light emitting unit includes a first semiconductor layer of a first conductivity type, a first light emitting layer, and a second semiconductor layer of a second conductivity type which are each disposed successively in a direction away from the substrate. The second sub-light emitting unit includes the second semiconductor layer, a second light emitting layer, and a third semiconductor layer of the first conductivity type. Each layer is disposed successively in the direction away from the substrate. The first conductivity type is different from the second conductivity type.

Light emitting diode device, array substrate and display device

A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.

Manufacturing method of light emitting diode device and light emitting diode device having light emitting units with each light emitting unit including second sub light emitting unit in tandem with first sub light emitting unit

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Beijing, China

Shuqian Dou