Nvidia Corporation

Marvel Technology (china) Co., Limited

Ubtech Robotics Corp Ltd

Shuo Zhang

Minto Zheng

Ruru Zhong

Eric Zhu

Town Zhang

Michael Zhai

Youjun Xiong

Jie Ma

Yizhang Liu

Ligang Ge

Chunyu Chen

Zheng Xie

Jie Bai

Jiangchen Zhou

Hongge Wang

Xingxing Ma

Meihui Zhang

Layout techniques for circuits on substrates are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between circuits while simultaneously providing for the rapid provision of transient power demands to the circuits. The layout techniques may also enable improved thermal management for the circuits.

Staggered dual-side multi-chip interconnect

A path planning method and a biped robot using the same are provided. The method includes: generating a candidate node set for a next foot placement based on a biped robot's own parameters and joint information of a current node, adding valid candidate nodes in the candidate node set to a priority queue so as to select optimal nodes for realizing next node expansion. These optimal nodes are output to generate a foot placement sequence from an initial node to a target node, which can greatly reduce the search amount for path nodes when the robot's legs intersect and touch the ground, thereby improving the efficiency of path planning.

Path planning method and biped robot using the same

A photo booth having a supporting stage includes the supporting stage, a rotatable shooting stand, and a driving assembly. The driving assembly is configured to drive the rotatable shooting stand to circumferentially rotate around the supporting stage. The supporting stage includes an upper cover and a reinforcement frame, and the reinforcement frame includes reinforcement ribs diverging from an central portion of the reinforcement frame to an edge of the reinforcement frame. The upper cover detachably covers the reinforcement frame; or the upper cover covers the reinforcement frame and the upper cover and the reinforcement frame are integrally formed; or the upper cover covers the reinforcement frame and the upper cover is welded to the reinforcement frame. The reinforcement frame includes a supporting ring, supporting rods, and a connecting portion. The supporting ring is generally annular.

Photo booth having supporting stage

A photo booth having detachable upper cover includes a supporting stage, a rotatable shooting stand, and a driving assembly. The driving assembly is configured to drive the rotatable shooting stand to circumferentially rotate around the supporting stage. The supporting stage includes an upper cover and a reinforcement frame, and the upper cover detachably covers the reinforcement frame. The reinforcement frame includes a supporting ring, six supporting rods, and a connecting portion. The supporting ring is generally annular, and the six supporting rings and the connecting portions are disposed in a ring of the supporting ring. A first end of each of the six supporting rods is connected to an inner wall of the supporting rings, and a second end of each of the six supporting rods is connected to the connecting portion. The six supporting rods are uniformly disposed along a circumferential direction of the supporting ring.

Photo booth having detachable upper cover

Layout techniques for chip packages on printed circuit boards are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between chip packages while simultaneously providing for the rapid provision of transient power demands to the chip packages. The layout techniques may also enable improved thermal management for the chip packages.

Growing community of inventors

Shenzhen, China

Shuo Zhang