Jcet Group Co., Ltd.

Shuo Liu

Yaojian Lin

Danfeng Yang

Jian Chen

Chenye He

Chen Xu

Xueqing Chen

Shasha Zhou

Haitao Shi

Jian Zuo

Yinghua Gao

The present invention provides an antenna packaging structure and a manufacturing method thereof. An antenna and a chip are respectively disposed on two sides of a substrate layer, antenna layers are formed by an antenna support member, a first antenna layer located above the antenna support member and a second antenna layer located below the antenna support member together, and interlayer dielectrics of the antenna support member and the antenna layers are low dielectric loss materials, so that a heterogeneous and isomerous antenna structure is formed, thereby reducing the problems such as current leakage and stray capacitance in the packaging structure caused by dielectric loss, and reducing a size of the antenna packaging structure.

Antenna packaging structure and manufacturing method thereof

The present invention provides an SIP package structure. The SIP package structure comprises a first module, a second module and a shielding assembly, wherein the first module and the second module are horizontally distributed or vertically stacked; electromagnetic sensitive frequencies of the first module and the second module are different; the shielding assembly comprises a first shielding structure covering the first module and a second shielding structure covering the second module; and at least part of the first shielding structure and/or at least part of the second shielding structure are/is disposed between the first module and the second module.

SIP package structure

The present invention provides a fan-out package structure and a method for manufacturing the same. The fan-out package structure includes at least one chip and at least one redistribution layer on a functional surface side of the chip, and the redistribution layer includes a dielectric layer and a metal wiring layer distributed within the dielectric layer. The fan-out package structure further includes at least one dummy wafer on the redistribution layer, and the dummy wafer is insulated from the chip and in contact with the metal wiring layer. By providing the dummy wafer on the redistribution layer and configuring the dummy wafer to connect to the metal wiring layer, the dummy wafer can not only function to support the structure and suppress the warpage, but also form a continuous heat dissipation channel, thereby improving thermal management capability of the fan-out package structure.

Fan-out package structure and method for manufacturing the same

The present invention relates to an integrated package structure. The integrated package structure includes a main substrate, a first module, a second module, a cavity element and a large-size device, wherein the main substrate includes a first surface of the main substrate and a second surface of the main substrate opposite to each other; the first module and the second module are stacked; the first module and the second module which are stacked, the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate, and are respectively electrically connected to the main substrate. Owing to this arrangement, the demand of a current integrated package structure for a further high-density, miniaturized, multi-dimensional and multi-demand layout design can be met.

Integrated package structure

The present invention provides a dual-substrate antenna package structure and a method for manufacturing the same. The package structure includes a main substrate and at least one antenna substrate. The antenna substrate is provided on a pad of the main substrate by an array of solder balls placed on the antenna substrate, at least one chip is electrically connected to the main substrate, and metal wiring provided on the main substrate electrically connects the pad to the chip. The array of solder balls includes support solder balls and conventional solder balls, and the support solder balls have a melting point high than 250° C. A spacing distance between the antenna substrate and the main substrate can be kept stable during the reflow soldering process and subsequent processes because the support solder balls having the high melting point can always maintain the stability of the structure during the reflow soldering process.

Dual-substrate antenna package structure and method for manufacturing the same

The present invention provides a package structure and a method for manufacturing the same. The package structure includes at least two electrical elements, a second reconstruction layer, and a metal lead frame, wherein at least one of the electrical elements is a chip, at least one of the electrical elements has a first reconstruction layer, and the second reconstruction layer has a smaller pin pitch than that of the metal lead frame; the second reconstruction layer has a first surface and a second surface, a functional surface of the electrical element is disposed on and connected to the first surface, and at least one of the electrical elements is connected to the second reconstruction layer; and the second surface is disposed on and connected to the metal lead frame. A fan-out package structure is formed on the metal lead frame, which improves the heat dissipation capacity of the chip.

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Wuxi, China

Shuo Liu