Tsinghua University

Globalwafers Co., Ltd.

Shuo-Hung Hsu

Yu-Syuan Lin

Chuan-Wei Tsou

Yi-Wei Lien

Yi-Wei Lian

Wen-Ching Hsu

Chih-Yuan Chuang

Man-Hsuan Lin

Walter Tony Wohlmuth

Rachit Joshi

Che-Ming Liu

A radio frequency integrated circuit comprising: at least one transistor; a matching circuit coupled to said transistor; and at least one bump is used to form a passive element in said matching circuit, and said bump is used for radio frequency matching, the bumps can be used as passive components for amplifier harmonic impedance matching or the bumps can be the amplifier's passive components of the harmonic impedance matching, both of them can enhance the power, bandwidth and efficiency of amplifiers and integrated circuits.

Radio frequency integrated circuit

An epitaxial substrate and a method for forming the same are disclosed. The epitaxial substrate includes a substrate, a deposition layer, a buffer layer and an epitaxial layer. The deposition layer is directly formed on the substrate, wherein the deposition layer includes a gradient doping concentration, and has a first surface and a second surface which are opposite to each other; the gradient doping concentration has a minimum value at the first surface. The buffer layer is formed on the deposition layer, and an epitaxial layer is formed on the buffer layer. The epitaxial layer is mainly formed of group III-V nitride. The substrate and the deposition layer are formed of homogeneous material. Since the deposition layer is directly formed on the substrate, and the deposition layer and the substrate are formed of a homogeneous material, the epitaxial substrate includes a good heat dissipation efficiency and low leakage current.

Epitaxial substrate and method for forming the same

A radio frequency (RF) power transistor includes a semiconductor heterostructure, a gate electrode, a drain electrode and a source electrode. The drain electrode includes an ohmic contact and a Schottky contact extending from the ohmic contact toward the gate electrode, spaced apart from the gate electrode () by a distance (L), and having a length (L) being not less than 2 &#x3bc;m and not greater than 4 &#x3bc;m. A ratio of the length (L) to a sum of the length (L) and a distance (L) is greater than 0.83 and less than 0.98.

RF power transistor

A Schottky barrier diode includes a substrate, a buffer layer formed on the substrate, an upper layer formed on the buffer layer, a first electrode layer formed on the upper layer as an anode of the Schottky barrier diode, a second electrode layer formed on the upper layer as a cathode of the Schottky barrier diode, and a first n-type doping region formed in the upper layer and under the first electrode layer, and contacting the first electrode layer. An edge of the first n-type doping region and an edge of the first electrode layer are separated by a first predetermined distance at a first direction at which the first electrode layer faces the second electrode layer.

Schottky barrier diode

A semiconductor is fabricated on a silicon (Si) substrate. The semiconductor is III-nitride based. The Si substrate is partially isolated. Etching is directly processed from top on a chip for solving wire-width problem. The Si substrate does not need to be made thin. The chip can be large scaled and be prevented from bowing. Thus, the present invention simplifies producing procedure and reduces production cost. Besides, for a large-scaled chip, the breakdown voltage is enhanced; and, without making the Si substrate thin, the on-state current is remained the same and the heat problem is weakened.

Method of fabricating III-nitride based semiconductor on partial isolated silicon substrate

A Schottky diode structure and a method for fabricating the same, which are based on the principle of charge compensation, wherein a P-type gallium nitride layer is added to a Schottky diode structure, and wherein the PN junction of the P-type gallium nitride layer and the N-type gallium nitride layer decreases the non-uniformity of the surface electric field distribution, whereby the breakdown voltage of the element is raised.

Growing community of inventors

Hsinchu, Taiwan

Shuo-Hung Hsu