Hitachi Chemical Company, Ltd.

Shunya Yokozawa

Akio Takahashi

Motoyo Wajima

Hirosada Morishita

Kenji Tsukanishi

Yutaka Mizuno

Takeshi Shimazaki

Yutaka Itoh

Yoshinori Ejiri

Katsuyuki Masuda

Hideo Nakako

Kazunori Yamamoto

Yasushi Kumashiro

Youichi Machii

Ritsuro Tada

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.

Process for producing fire retardant and heat resistant copper-clad

A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

Thermosetting prepolymer from polyfunctional maleimide and bis maleimide

A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

Imide prepolymer from reaction of epoxy compound with bis-imide/diamine

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Oyama, Japan

Shunya Yokozawa