Fuji Electric Co., Ltd.

Shunta Horie

Susumu Iwamoto

The semiconductor device includes a substrate having a main surface, a plurality of conductive patterns provided on the main surface, a plurality of switching elements disposed on one of the conductive patterns, each switching element having a first electrode and a second electrode and being connected to the one of the conductive patterns through its first or second electrode, and at least one first wiring member each directly connecting the first electrodes of two switching elements that are respectively disposed on different conductive patterns and are electrically connected in parallel.

Semiconductor device

A semiconductor module has a metallic base plate; an insulated circuit board fixed on the metallic base plate; a semiconductor element mounted on the insulated circuit board; a resin case to house the semiconductor element, and having an upper surface with an opening; a terminal exposed from the opening of the resin case to an outer portion in a vertical direction; and an insulating holding piece having a triangular or a rectangular cross-section and one surface contacting the terminal. The terminal has a projecting portion disposed inside the resin case to restrict a movement of the terminal in the vertical direction. The resin case has a first recess portion to fit the projecting portion and a second recess portion disposed on the upper surface of the resin case so that the holding piece pushes the projecting portion on the terminal toward the first recess portion for insertion.

Growing community of inventors

Kawasaki, Japan

Shunta Horie