Toyoda Gosei Co., Ltd.

Shunsuke Teranishi

Hisao Sato

A semiconductor light emitting element includes an n-type semiconductor layer containing n-type impurities, a light emitting layer stacked on the n-type semiconductor layer, and a p-type semiconductor layer stacked on the light emitting layer and containing p-type impurities. The light emitting layer includes three or more well layers, and four or more barrier layers composed of a group-III nitride semiconductor having a larger band gap than that of the well layers, and each of the three or more well layers is sandwiched from both sides by neighboring two of the barrier layers. The three or more well layers include plural n-side well layers each having a first thickness to emit light of a common wavelength, and one or plural p-side well layers each having a second thickness larger than the first thickness and having a different composition from the n-side well layers to emit light of the common wavelength.

Semiconductor light emitting element and light emitting device

While maintaining unity of wavelength of light emitted from a semiconductor light emitting element, decrease of light emission efficiency with an increase in environmental temperature is suppressed. A semiconductor light-emitting element includes: an n-cladding layer; a light emitting layer laminated on the n-cladding layer; and a p-type semiconductor layer laminated on the light emitting layer. The light emitting layer includes a first barrier layer to an eighth barrier layer and a first well layer to a seventh well layer, and a single well layer is sandwiched by two barrier layers. The first well layer to the fifth well layer have a common standard well thickness and a common composition, and the sixth well layer and the seventh well layer are set at a maximum well thickness larger than the common standard well thickness and have a composition whose band gap energy is larger than that of the common composition.

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Ichihara, Japan

Shunsuke Teranishi