Murata Manufacturing Co., Ltd.

Shunsuke Takeuchi

Akihiro Motoki

Makoto Ogawa

Kenichi Kawasaki

Toshiyuki Iwanaga

Shigeyuki Kuroda

Masahito Saruban

Seiichi Nishihara

Shuji Matsumoto

Yoji Yamamoto

Hideyuki Kashio

Masashi Nishimura

Tatsuo Kunishi

Seiichi Matsumoto

Ichiro Nakamura

Norihiro Yoshikawa

Junichi Saito

Tatsunori Kobayashi

A ceramic electronic component includes a ceramic body and an external electrode including an end surface region on an end surface of the ceramic body and a side surface region on a side surface of the ceramic body. The side surface region includes a first end portion electrically connected to the end surface region, and a second end portion opposite to the first end portion. At at least a portion where an internal electrode is led out, the end surface region includes a high glass content layer in contact with the ceramic body. At least the second end portion and a vicinity thereof includes a low glass content layer in contact with the ceramic body. At least a portion of the side surface region includes a surface with the low glass content layer exposed.

Ceramic electronic component and method for manufacturing ceramic electronic component

A laminated ceramic electronic component mounting structure includes a laminated ceramic electronic component including a ceramic body, first and second inner electrodes in the ceramic body including opposed portions including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode; and a circuit board including first and second electrode lands electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component is mounted, wherein widths of the first and second electrode lands are smaller than widths of the first and second inner electrodes at the opposed portions.

Laminated ceramic electronic component mounting structure

A laminated ceramic electronic component includes a ceramic body, first and second inner electrodes within the ceramic body and including opposed portions opposed to each other in the thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode. The widthwise distance between first widthwise edges and second widthwise edges of the first and second terminal electrodes are smaller, in plan view, than widths of the first and second inner electrodes at the opposed portions.

Laminated ceramic electronic component

A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600&#xb0; C. or more.

Method for manufacturing multilayer electronic component

A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Method for manufacturing a multilayer ceramic electronic component

Multilayer electronic component and method for manufacturing the same

A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 &#x3bc;m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 &#x3bc;m or less. The metal particles defining the lower plating films may be Cu particles.

Laminated electronic component and method for manufacturing the same

A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.

A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.

Laminated electronic component including water repellant and manufacturing method therefor

In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800&#xb0; C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800&#xb0; C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000&#xb0; C. or more but also a step of maintaining a temperature of about 600&#xb0; C. to 900&#xb0; C. at least once before the step of maintaining the top temperature.

Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor

A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 &#x3bc;m on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.

Method for manufacturing laminated electronic component

A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.

Electronic component including protruding mounting surface regions and method for manufacturing the same

An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 &#x3bc;m or more.

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Echizen, Japan

Shunsuke Takeuchi