Fujitsu Corporation

Shunsuke Sone

Yoshiaki Yanagida

Teruaki Nishioka

Tomokazu Sugiyama

Koji Sudo

Hirokazu Yamanishi

Koji Suto

Kazuo Yokoi

Michinao Nomura

A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.

Manufacturing apparatus and manufacturing method for an electronic component

A mounter apparatus includes a first block disposed so as to be able to be reciprocated by an actuator in a first direction, the first block has a conical hole having a conical internal wall and an axis parallel to the first direction, a second block disposed so as to face the first block and is held by the first block with an elastic body interposed between the first block and the second block, the second block moving by the actuator together with the first block in the first direction, the second block approaching the first block while compressing the elastic body, the second block moving away from the first block due to an elastic force of the elastic body, and a suction head portion rotatably held by the second block and has a suction nozzle on the opposite side from the side where the first block is disposed.

Mounting apparatus and method

An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium. The apparatus for processing a magnetic head slider includes a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the discoid recording medium, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.

Apparatus for processing a magnetic head slider

A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Processing method and apparatus

An electronic apparatus includes a housing, a first unit that is attached through a front side of the housing, a second unit that is attached through a backside of the housing, a panel that has a first surface connected to the first unit, and a second surface connected to the second unit, and establishes an electric connection between the first unit and the second unit, and a support member to which the panel is attached, the support member being movable relative to the housing in a side surface direction of the housing.

Electronic apparatus

A lapping machine comprises a lapping surface plate () rotated by a rotating mechanism, a lapping jig () having a plurality of projections to bottom surfaces of which a work () to be lapped by a lapping surface on the lapping surface plate () is fitted, amount-of-projection adjusting elements () for adjusting the variation of the plurality of projections () to the lapping surface plate () individually, and a control circuit () for outputting variation-of-projection control signals to the variation-of-projection adjusting elements ().

Lapping machine, lapping method, and method of manufacturing magnetic head

Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Method and apparatus for polishing, and lapping jig

A lapping machine comprises a lapping surface plate ( ) rotated by a rotating mechanism, a lapping jig ( ) having a plurality of projections to bottom surfaces of which a work ( ) to be lapped by a lapping surface on the lapping surface plate ( ) is fitted, amount-of-projection adjusting elements ( ) for adjusting the variation of the plurality of projections ( ) to the lapping surface plate ( ) individually, and a control circuit ( ) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements ( ).

Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant. With this configuration, the spacing between any adjacent ones of the holes of the row tool can be easily reduced to thereby improve a working accuracy.

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Kawasaki, Japan

Shunsuke Sone