Sumitomo Electric Industries, Limited

Semiconductor Energy Laboratory Co., Ltd.

Shunsuke Sato

Ichiro Tonai

Shunpei Yamazaki

Seiichi Yoneda

Tomoya Saeki

Munetaka Kurokawa

Yusuke Negoro

Toshio Mizue

Naoki Nishiyama

Yasushi Fujimura

Takeya Hirose

Hiroki Inoue

Kazushige Oki

Manabu Shiozaki

Ryugen Yonemura

A multifunctional imaging device is provided. The imaging device includes first to fourth light-receiving elements and first and second functional layers. The first to fourth light-receiving elements are photoelectric conversion elements having sensitivity to light of different wavelengths from each other. The first and second functional layers each include first and second transistors. The first functional layer and the fourth to first light-receiving elements are stacked in this order over the second functional layer. In each of the first to fourth light-receiving elements, a first conductive layer, a first buffer layer, a photoelectric conversion layer, a second buffer layer, and a second conductive layer are stacked in this order. The photoelectric conversion layer includes an organic compound, and the first buffer layer and the second buffer layer each include a metal or an organic compound. The first transistor is electrically connected to the first conductive layer of any of the first to fourth light-receiving elements. The second transistor is electrically connected to the first transistor.

Imaging device

An imaging device that has an image processing function and is capable of a high-speed operation is provided. The imaging device has an additional function such as image processing, and can retain analog data obtained by an image capturing operation in pixels and extract data obtained by multiplying the analog data by a given weight coefficient. In the imaging device, the data is stored in a memory cell and pooling processing of data stored in a plurality of memory cells can be performed. The pixels are provided so as to have a region overlapping with at least one of the memory cells, a pooling processing circuit, and a reading circuit of the pixels; thus, an increase in the area of the imaging device can be inhibited even with an additional function.

Imaging device and electronic device

An imaging device that has an image processing function and is capable of operating at high speed is provided. The imaging device has an additional function such as image processing, image data obtained by an imaging operation is binarized in a pixel unit, and a product-sum operation is performed using the binarized data. A memory circuit is provided in the pixel unit and retains a weight coefficient used for the product-sum operation. Thus, an arithmetic operation can be performed without the weight coefficient read from the outside every time, whereby power consumption can be reduced. Furthermore, a pixel circuit, a memory circuit, and the like and a product-sum operation circuit and the like are stacked, so that the lengths of wirings between the circuits can be reduced, and high-speed operation with low power consumption can be performed.

An optical module with a laser diode (LD) without any temperature control and an optical fiber that is coupled with the LD through the two lens system is disclosed. The two lens system first converts laser beam into collimated beam and second concentrates the collimated beam onto the optical fiber. A beam splitter is disposed between the lenses and splits the collimated beam toward a photodiode (PD). The PD, which receives the split collimated beam in a back surface thereof, provides an anti-reflection film in the back surface. The anti-reflection film eliminates multi reflections occurred within the PD.

Optical module having two lens system and monitor photodiode between two lenses

An optical module that provides a feedthrough to carry an electrical signal output from and/or provided to a semiconductor optical device is disclosed. The feedthrough has a signal pad that carries the electrical signal thereon and at least two ground pads sandwiching the signal pad therebetween. The feedthrough further provides a cavity provided under the signal pad and spaces each between the signal pad and the ground pads.

Optical module implementing laser diodes

A transmitting optical module that includes multi-laser diode (LDs) and a planar lightwave circuit (PLC) to multiplex optical beams each output from the optical sources is disclosed. The PLC is mounted on a carrier through a WG carrier in upside down arrangement. The LDs are also mounted on the carrier through an LD carrier. The LDs and the PLC are optical coupled with two lenses each having respective optical axes offset from the other such that the optical coupling of the optical beam inputting the PLC becomes a maximum.

Transmitting optical module implementing optical waveguide device

A transmitter optical module that implements with two or more laser diodes (LDs) therein is disclosed. The LDs are mounted on a common sub-mount independent of driving circuits and driven by the driving circuits in the shunt-driving mode. The cathode of the LDs are independently, namely, isolated from the ground of the neighbor LDs, connected to the ground within the driving circuits but floated from the chassis ground.

Transmitter optical module implemented with a plurality of signal sources

A transmitter module having a plurality of semiconductor laser diodes (LDs) as optical signal sources that emit optical respective optical beams with specific wavelengths different from other is disclosed. The transmitter module includes, in addition to the LDs, a driver to drive LDs in the shunt-driving configuration. Inductors through which the bias currents for the LDs are provided are mounted on the driver as interposing a spacer and a top carrier.

Transmitter module outputting wavelength multiplexed light

A transmitter optical module is disclosed. The optical module includes a plurality of LDs each emitting light with specific wavelengths different from others, a TEC including a post in bottom plate thereof through which currents to driver the TEC is supplied, and a body portion including an electrical plug made of multi-layered ceramics. The multi-layered ceramic in a lowermost ceramic layer thereof provides electrical pads to supply current to the TEC through the post. The post and the pads are configured in side-by-side arrangement such that the post in the TEC is put between two pads in the lowermost ceramic layer.

Transmitter optical module implemented with thermo-electric controller

An optical transmitter module installing a thermo-electric controller (TEC) is disclosed. The optical module has a rectangular box portion as a package made of a multi-layered ceramics, within which the TEC is installed. The TEC has electrodes through which a current to driver the TEC electrically is provided. The module has a feature that the electrodes of the TEC is directly in contact with a pad provided in the back surface of the multi-layered ceramic housing.

Optical module and optical transceiver installing the same

An optical module is disclosed where the module includes an optical active device mounted on a carrier via a sub-mount, and a lens assembly mounted on the carrier and optically coupled with the device and an external fiber. A feature of the optical module is that the lens assembly has a metalized portion fixed to the carrier by the soldering.

Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount

An optical module on the invention provides a multi-layered ceramic package in which the LD, the sub-mount to mount the LD, the optical component to bend the optical axis of the light emitted from the LD toward the lens, and the monitor PD to monitor a portion of the light transmitted through the optical component. These components are mounted on a metal in the package with an adhesive. At least one of the sub-mount and the optical component provides a chamfer in a front bottom corner thereof to provide a room to receive fillets formed in the surfaces facing to and abutting against the other surface.

Optical module with optical axis bent perpendicularly within package

An optical module has disclosed, in which the optical module electrically isolates the optical device from the sleeve shell with a simple and a cost-effective arrangement. The optical receptacle includes the metal holder to hold the stub, the insulating bush to press-fit the holder, and the metal shell to press-fit the bush. The bush electrically isolates the holder from the shell, and has a length press-fitted to the shell overlapping with a length press-fitted to the holder.

Optical module with an optical device electrically isolated from a sleeve shell

The present invention provides an optical module with a relatively wider mounting area for the devices with a CAN package. The optical module of the present invention provides the stem and the cap, both of which form a cavity where the devices are to be installed. The stem provides the block extruding from the primary surface of the stem into the cavity. The block mounts the optical and electrical devices in surfaces opposite to each other, and provides feedthrough pins between these two surfaces. The device mounted in each surface may be electrically connected through these feedthrough pins.

Optical module having a block with feedthrough pins

The present invention provides an optical module with a new stem to reduce the EMI noise and to enhance the ESD tolerance of the optical transceiver. The optical module comprises the stem, a cap and a optical device installed in a space formed by the stem and the cap. The stem includes a center portion that mounts the optical device and a peripheral portion that holds the cap. Between the center portion and the peripheral portion is provided with an insulator to electrical isolate two portions. The case lead directly connected to the center portion and to the circuit board within the transceiver may be fully isolated from the frame ground connected to the sleeve and the peripheral portion.

Growing community of inventors

Yokohama, Japan

Shunsuke Sato