Showa Denko Materials Co., Ltd.

Hitachi Chemical Company, Ltd.

Tokyo Seimitsu Co., Ltd.

Hitachi, Ltd.

Shunsuke Otake

Takashi Masuko

Mamoru Kimura

Mikio Endo

Tomoaki Shibata

Akiyoshi Komura

Shinji Sugimoto

Tomonori Minegishi

Hidenori Abe

Hanako Yori

Tetsuo Yoshida

Seikichi Masuda

Masayasu Fujieda

Tatsuya Matsuoka

Masatoshi Koike

A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.

Prober controlling device, prober controlling method, and prober

A resin film includes a resin composition for forming a flexible resin layer. The resin composition includes an elastomer, a polymerizable compound, and a polymerization initiator. A laminated film includes a base material film, a resin film formed on the base material film, and a protective film attached to the resin film.

Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film

Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.

Method for producing semiconductor device

Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer

Growing community of inventors

Tokyo, Japan

Shunsuke Otake