Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Hogy Medical Co., Ltd.

Kyushu University

Shunsuke Nagai

Hikari Murai

Tomohiko Kotake

Shin Takanezawa

Masato Miyatake

Shintaro Hashimoto

Yasuo Inoue

Hiroki Kuzuoka

Eisuke Haba

Nobuyuki Ogawa

Kenji Takaoka

Kenji Suzuki

Shinichiro Abe

Makoto Hashizume

Hiroyuki Izumi

Shinji Tsuchikawa

Hiroyasu Fujita

Ryu Nakadate

Hajime Kenmotsu

Jiro Kato

A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer, and a ratio of the structural unit derived from a nitrile group-containing monomer to a total of structural units derived from each monomer is from 90% by mole to less than 100%. 

Resin for energy device electrode, composition for forming energy device electrode, energy device electrode, and energy device

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Provided are an eyeglass-mounted image display device capable of adjusting the interval between, height of, and elevation/depression angle of viewers detachably attached to eyeglasses, and an image display system using the eyeglass-mounted image display device. The eyeglass-mounted image display device includes: viewersdisplaying an image from an endoscope serving as an image output apparatus; and eyeglassesto which the viewersare detachably attached via an attaching member. The viewersare disposed in front of lensesof the eyeglassesand the interval between, height of, and elevation/depression angle of the viewers 7 are adjustable with the attaching member

Eyeglass-mounted image display device and image system

Provided are a positive electrode for a lithium ion secondary battery, the positive electrode including a positive electrode active material layer, the positive electrode active material layer including insulating polyolefin particles and an electroconductive material; an electrode for a lithium ion secondary battery, the electrode including an electrode active material layer, the electrode active material layer including polyolefin particles and a resin including a structural unit derived from a nitrile group-containing monomer; and a lithium ion secondary battery using the same.

Positive electrode for lithium ion secondary battery, electrode for lithium ion secondary battery, electrode active material layer including polyolefin particles, and lithium ion secondary battery

An operating portion which allows a bending treatment instrument to be inserted into an endoscope channel and bendably operated smoothly through intuition. The operating portion is connected with a device wire and bending wires and used to operate the treatment instrument and bend a freely bendable, bending treatment instrument, where the device wire is connected to a treatment instrument provided at a distal end of the bending treatment instrument and is used to operate the treatment instrument and the plurality of bending wires is used to bend the bending treatment instrument, the operating portion including: an operating portion body; a guide unit penetrated by the device wire; a bending wire pulling unit connected with the bending wires and swingably assembled onto the guide unit; and a grip portion connected with the device wire and configured to be reciprocable in an axial direction of the bending wire pulling unit.

Bending treatment instrument operating portion

The present disclosure provides a binder resin composition comprising a polyolefin particle, an organic solvent and a polymer that is soluble in the organic solvent, as well as an electrode for a lithium ion secondary battery and a lithium ion secondary battery each using the binder resin composition.

Binder resin composition, electrode for lithium ion secondary battery and lithium ion secondary battery

A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein Rand Rindependently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein Rand Rindependently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.

Prepreg, laminate obtained with the same and printed-wiring board

Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

Growing community of inventors

Ibaraki, Japan

Shunsuke Nagai