Olympus Corporation

Olympus Optical Company, Ltd.

Shunsuke Kurata

Yasunori Ikeno

Katsuyuki Hashimoto

Masahiko Yazawa

Yasutoshi Kitahara

Takahiro Komuro

Kazuhito Horiuchi

Yoshihisa Taniguchi

Haruyuki Tsuji

Yasutada Miura

Yoshiaki Suge

An inspecting apparatus for inspecting a substrate includes an objective lens attaching part equipped with a plurality of objective lenses each having a different working distance (WD), an objective lens exchanging device which exchanges the objective lens, and a loading stage which is opposed to the objective lens and on which the substrate S is loaded. An objective lens detecting device detects the WD of the objective lens. Displacing devices relatively displace the objective lens and the loading stage in the direction of the optical axis of an inspecting light path and a direction rectangular to the optical axis. And a displacement controlling device controls the relative displacement of the objective lens and the loading stage in the direction rectangular to the optical axis when the lens detecting device detects that the WD of the objective lens is shorter than a predetermined WD.

Inspecting apparatus and inspecting method

It is an object of the present invention to provide a substrate processing apparatus, comprising a housing body mounting unit that is capable of mounting a plurality of housing bodies which can house a plurality of substrates, a processing apparatus main body for processing a substrate extracted from the housing body, a transportation unit for transporting the substrate between the housing body and the processing apparatus main body, a processing control unit for controlling the transportation unit and making it transport the substrate between the housing body and the processing apparatus main body, and a transportation control unit for controlling the transportation unit and making it transport the substrate from one housing body to another housing body without passing through the processing apparatus main body.

Substrate processing apparatus and substrate processing system

An image inspection system includes a mount stage for a subject; an observation optical system for imaging light reflected by the subject; a focal position moving mechanism for relatively moving a position of the observation optical system in a depth direction of focus with respect to the subject; a mechanism for detecting a first target focal position by using light reflected by the subject; a focal position correcting device for determining a second target focal position offset from the first target focal position; a device for driving the focal position moving mechanism so as to focus on the second target focal position; and a section for storing condition setting data for each subject, which includes an offset value for determining the second target focal position. The focal position correcting device determines the second target focal position in accordance with the offset value in the condition setting data.

Image inspection system for correcting focal position in autofocusing

A substrate inspection apparatus includes a recipe preparation unit that batch-allocates a plurality of slots containing substrates of each type with a corresponding one of a plurality of original recipes to the each type, the plurality of original recipes corresponding to different types of substrates respectively, so as to prepare an actual recipe based on the plurality of original recipes, and to inspect the different types of substrates according to the actual recipe.

Method and apparatus for inspecting semiconductor wafer

A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Semiconductor wafer inspection apparatus

An object image data obtained by image taking by an image taking device, while a distance between a stage, on which an object is placed, and the image taking device is varied, is captured by a focus processing device at each predetermined timing. The focus processing device retrieves contrast data indicating a maximum value from the captured respective object image data, and stores the object image data in the image information memory. The object image data of the contrast data indicating the maximum value is read from the image information memory, and outputted and displayed on a display section.

Image processing apparatus

An object is held on a stage of an equipment, the stage is rotated in order to acquire a detection signal corresponding to a position of an outer peripheral edge of the object, a displacement of the object with respect to an alignment reference position is obtained based on this detection signal, and the stage is subjected to movement control so as to eliminate this displacement, thereby aligning the object.

Alignment apparatus for object on stage

An imaging device is provided which includes an LED, a telecentric lens which collimates LED light and converts light reflected by an object, a half mirror which reflects the LED light toward the telecentric lens and allows transmission of the reflected light converged by the telecentric lens, a diaphragm, and a two-dimensional imaging element.

Small sized imaging device which detects position information and image information

An alignment apparatus which obtains an amount of correction for centering a semiconductor wafer from four points of a wafer edge detected by noncontact proprioceptors in a wafer delivery position P where the semiconductor wafer is passed to a wafer carrying unit from a wafer carrying robot and centers the semiconductor wafer.

Alignment apparatus

In an optical device having an objective lens for magnifying an image of a target object and a focusing unit including a laser source for irradiating the target object through the objective lens and a focus detecting light-receiving section for receiving light reflected from the target object, positions in the periphery of the target object are detected by using the laser beam emitted from the laser source of the focusing unit while changing a relative positional relationship between the target object and the objective lens.

Growing community of inventors

Kamiina-gun, Japan

Shunsuke Kurata