Senju Metal Industry Co., Ltd.

Shunsuke Kimoto

Hiroyuki Inoue

Tsutomu Hiyama

Hirokazu Ichikawa

Tomotake Kagaya

Tadayoshi Ohtashiro

A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber () in which a work () is solderable under vacuum environment, an operation part () that inputs and sets vacuum pressure in the chamber (), a pump () that performs vacuum drawing on the interior of the chamber (), a pressure sensor () that detects pressure in the chamber (), and a control portion () that adjusts the set vacuum pressure in the chamber () based on a pressure detection signal (S) output from the pressure sensor (), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG.

Soldering apparatus and vacuum-soldering method

In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#through #) with the gradients &#x3b8; plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient &#x3b8; in the evacuation control property.

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Tokyo, Japan

Shunsuke Kimoto