Murata Manufacturing Co., Ltd.

Shunsuke Kido

Takeshi Nakao

Michio Kadota

Kenji Nishiyama

Yasuharu Nakai

Hajime Kando

Daisuke Yamamoto

Nobuyuki Sakai

Naokatsu Fujinami

A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001&#x3bb;, where the wavelength of an acoustic wave is &#x3bb;.

Acoustic wave device and method for fabricating the same

A method for fabricating an acoustic wave device includes the steps of forming an insulating material layer on a piezoelectric substrate, forming a patterned photoresist on the insulating material layer, patterning the insulating material layer, and forming a piezoelectric-substrate exposed depression corresponding to a region where an interdigital transducer electrode is to be formed on a first insulator layer composed of the insulating material layer, depositing a metallic material on the piezoelectric substrate to form the interdigital transducer electrode in the piezoelectric-substrate exposed depression such that the overall interdigital transducer electrode is thinner than the first insulator layer and coating the photoresist with a metallic material, removing the photoresist and the metallic material on the photoresist, and depositing a second insulator layer so as to cover the interdigital transducer electrode and the first insulator layer.

Method for fabricating acoustic wave device

An acoustic wave element includes an IDT electrode in contact with a piezoelectric material and including a plurality of electrode fingers, which include first and second electrode fingers that adjoin each other in an acoustic wave propagation direction and that connect to different potentials and a first dummy electrode finger facing the first electrode finger via a gap located on an outer side in an electrode finger length direction of the first electrode finger. At an area near the gap, first protrusions are provided in at least one of the first electrode finger and the first dummy electrode finger, the first protrusion protruding in the acoustic wave propagation direction from at least one of side edges of the at least one of the first electrode finger and the first dummy electrode finger. The acoustic wave element has greatly improved resonance characteristics of a resonance frequency and prevents short-circuit failure between electrode fingers and degradation in insulation properties.

Acoustic wave element having an electrode finger with a protrusion

A high-frequency dielectric ceramic member is composed of an oxide ceramic containing Mg, Ba, Re, Ti, and O, wherein Re is at least one element selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Dy, and Er. The oxide ceramic is represented by the formula aMgO-bBaO-cReO-(100-a-b-c)TiO, wherein n=3 when Re is La, Nd, Sm, Eu, Dy, or Er, n=11/3 when Re is Pr, and n=4 when Re is Ce, wherein a, b, and c, in mole percent, satisfy the relationships 10.0&#x2266;a&#x2266;62.0, 0&#x3c;b&#x2266;14.0, and 0&#x3c;c&#x2266;16.5. A dielectric resonator, a dielectric filter, a dielectric duplexer, and a communication device, each including the high-frequency dielectric ceramic member, are also disclosed.

Growing community of inventors

Kusatsu, Japan

Shunsuke Kido