Nitta Corporation

Shunsuke Iwata

Itaru Hatano

Hirokazu Nitta

Atsushi Matsumoto

A gripping device includes a partition film that is elastically deformable, a vacuum pump (deformation unit) that elastically deforms the partition film, and a cylindrical gripping portion that extends from the peripheral edge of the partition film and is elastically deformed in the central axis direction along with the elastic deformation of the partition film to wrap a workpiece. When the gripping portion comes into contact with the workpiece, a sealed space is formed between the workpiece, the gripping portion, and the partition film. Since the volume of the sealed space increases due to the elastic deformation of the partition film, a negative pressure is generated in the sealed space. The gripping device reliably grips the workpiece by a frictional force acting between the workpiece and the gripping portion and a suction force due to a negative pressure generated in the sealed space.

Gripping device and industrial robot

There is provided a gripper, a gripping device, and an industrial robot that can more reliably grip a workpiece without using a granular material. The gripper includes integrally: a palm portion; a plurality of finger portions protruding from a periphery of the palm portion and configured to fall toward the palm portion by deforming the palm portion in a thickness direction; a connecting portion formed in a position surrounding an outer edge of the palm portion on a side opposite to a side formed with the finger portions, the connecting portion connected to a case; and a high-strength portion provided between the palm portion and the connecting portion, the high-strength portion having a predetermined length from the outer edge of the palm portion in the thickness direction of the palm portion, and the high-strength portion being less likely to be deformed than the palm portion.

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Yamatokoriyama, Japan

Shunsuke Iwata