Yupo Corporation

Shunsuke Honda

Takahiko Ueda

Takuya Ikarashi

Yuta Iwasawa

Yuichi Iwase

Masahiko Ueno

A laminate including at least a heat-sensitive adhesive layer, a substrate layer, and a protective layer in this order, wherein the substrate layer has a thermoplastic resin film, the heat-sensitive adhesive layer contains a higher fatty acid amide, and the protective layer contains a silicone-based release agent. An in-mold label comprising this laminate. A molded body obtained by affixing this in-mold label. An in-mold label in the form of a roll obtained by winding this in-mold label. This invention provides an in-mold label that is less susceptible to dirt and scratches, excellent in decorativeness and visibility, less likely to cause friction when the labels are stacked on each other, and easy to handle, and has strong adhesive strength to a molded body.

Laminate, in-mold label, labeled molded body, rolled in-mold label, and stacked in-mold labels

A decrease in the adhesiveness of an in-mold label can be suppressed even when a silicone transferred from the protective layer side to the heat-sealable resin layer side. An in-mold label includes a substrate layer, a printed layer provided on one surface of the substrate layer, and a heat-sealable resin layer provided on the other surface of the substrate layer, a protective layer containing a silicone is provided on an outermost surface on one surface side of the substrate layer on which the printed layer is provided, and an adhesive strength decrease-inhibiting layer containing a (meth)acrylic acid based copolymer having a polar group is provided on an outermost surface on the other surface side of the substrate layer on which the heat-sealable resin layer is provided.

In-mold label, and container with in-mold label

A thermoplastic resin film of the present invention contains at least a base layer containing a thermoplastic resin and a heat seal layer containing a thermoplastic resin; a melting point of the thermoplastic resin contained in the heat seal layer is lower than a melting point of the thermoplastic resin of the base layer; a core roughness depth Rk of a surface of the heat seal layer being from 1.2 to 9.0 &#x3bc;m; and a ratio Rzjis/Rk of a ten point height of roughness profile Rzjis to a core roughness depth Rk of the surface of the heat seal layer measured in accordance with JIS B0601:2013 Appendix 1 being from 2.0 to 9.0.

Growing community of inventors

Ibaraki, Japan

Shunsuke Honda