Denso Corporation

Shunsuke Harada

Shinichiro Miyahara

Takashi Nomura

Yusuke Nonaka

Tomoo Morino

Shin Takizawa

Kenta Gouda

A semiconductor device includes a cell portion and a peripheral portion. The cell portion has a semiconductor element including a drift layer, a first impurity region, a second impurity region, trench-gate structures, a high-concentration layer, an interlayer insulating film, a first electrode and a second electrode. The interlayer insulating film is located on the trench-gate structures, the first impurity region and the second impurity region, and has a first contact hole communicating with the first impurity region and the second impurity region. The peripheral portion has a section facing the cell portion in one direction, and the interlayer insulating film further has a second contact hole at the section of the peripheral portion. The second contact hole exposes the first impurity region, and the first electrode is electrically connected to the first impurity region through the second contact hole in the peripheral portion.

Semiconductor device

A semiconductor device includes a vertical semiconductor element having a deep layer, a current dispersion layer, a base region, a high-concentration region, and a trench gate structure. The deep layer has multiple sections being apart to each other in one direction. The current dispersion layer is between adjacent two of the sections of the deep layer. The high-concentration region is on a portion of the base region. The trench gate structure includes a gate trench, a gate insulation film and a gate electrode. The current dispersion layer is at a bottom of the trench gate structure, and has an ion-implanted layer extending from a bottom portion of the gate trench to a bottom portion of the deep layer or a location below the bottom portion of the deep layer.

Semiconductor device and method for manufacturing the same

A semiconductor device includes a semiconductor substrate, an insulating film disposed above the semiconductor substrate, a temperature detecting element disposed on the insulating film, and an anode side region and a cathode side region respectively located on an anode side and a cathode side of the temperature detecting element. The anode side region or the cathode side region includes one or more capacitance elements, and a sum of capacitance values of the capacitance elements is larger than a capacitance value of the temperature detecting element.

Growing community of inventors

Kariya, Japan

Shunsuke Harada