Senju Metal Industry Co., Ltd.

Shunsaku Yoshikawa

Takashi Saito

Hikaru Nomura

Tsukasa Ohnishi

Yoshie Yamanaka

Kanta Dei

Naoko Izumita

Yuuki Iijima

Takahiro Matsufuji

Ken Tachibana

Takahiro Yokoyama

Yoshie Tachibana

Seiko Ishibashi

Masayuki A Suzuki

Naoko Hirai

Sakie Okada

Rei Fujimaki

Tomoki Sasaki

Shunsuke Koga

Toru Hayashida

Keitaro Shimizu

Hideyuki Komuro

Taro Itoyama

Motoki Koroki

Yuki Iijima

Hiroshi Okada

Koji Watanabe

Minoru Ueshima

Kyu-Oh Lee

Yoshitsugu Sakamoto

Masato Shimamura

Yoko Kurasawa

Hiroki Sudo

Kazuyori Takagi

Kenzo Tadokoro

Hiroki Ishikawa

Yutaka Chiba

Hiroyuki Yamada

Tomoko Nonaka

Tokuro Yamaki

Mitsuhiro Kosai

Shigeto Suzuki

Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Solder alloy, solder ball, and solder joint

Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, —Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn

Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013≤(Ag+Cu+Ni+Bi)×Ge≤0.027 (1), Sn×Cu×Ni≤5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Lead-free and antimony-free solder alloy, solder ball, and solder joint

A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.

Method for step-soldering

Provided are a solder, a solder alloy, a solder ball, a solder paste, and a solder joint, which have a low melting point, high hardness in a high-temperature environment, heat cycle resistance, and electromigration resistance. The solder alloy has an alloy composition that includes by mass %, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: more than 0% and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, with the balance being Sn.

Solder alloy, solder ball, solder paste, and solder joint

A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device

Provided are a solder alloy and a solder joint, which have a narrow ΔT to suppress solder bridges and solder icicles, and a small amount of dross generated in a solder tank, suppress Cu leaching, and have higher strength. The solder alloy has an alloy composition of, by mass %, Cu: more than 2.0% and less than 3.0%; Ni: 0.010% or more and less than 0.30%; and Ge: 0.0010 to 0.20% with the balance being Sn. Preferably, by mass %, Cu is more than 2.5% and less than 3.0%, and the alloy composition satisfies the following relations (1) and (2): 2.400≤Cu+Ni+Ge≤3.190 (1), and 0.33≤Ge/Ni≤1.04 (2). Cu, Ni, and Ge in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Solder alloy and solder joint

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder () having a metal structure including a first phase () that is a continuous phase and a second phase () dispersed in the first phase (), the first phase () contains Sn, the second phase () is formed of an alloy containing Ni and Fe, and a grain boundary () of a metal is present in the first phase ().

Preform solder and method of manufacturing the same, and method of manufacturing solder joint

Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.

Solder paste

A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)&#x2264;0.945% (relation (1)), (P+Ge)&#x2264;0.15% (relation (2)), 2.0&#x2264;(Cu+5Ni)/(P+Ge)&#x2264;1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

Solder alloy, cast article, formed article, and solder joint

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Solder alloy

The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.

Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint

A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93&#x2264;{(Ge/Sn)+(Bi/Ge)}&#xd7;(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.

Solder alloy, solder ball, solder preform, solder paste and solder joint

A solder alloy has an alloy composition including, in mass %, 0.8% to 10% of Cu and Sn. The solder alloy includes an intermetallic compound. The intermetallic compound has a maximum grain size of 100 &#x3bc;m or less in a region at least 50 &#x3bc;m away from a surface of the solder alloy.

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Tokyo, Japan

Shunsaku Yoshikawa