Fujitsu Corporation

Fujitsu Frontech Limited

Dic Corporation

Shunji Baba

Yoshiyasu Sugimura

Hidehiko Kira

Shigeru Hashimoto

Hiroshi Kobayashi

Naoki Ishikawa

Norio Kainuma

Tsuyoshi Niwata

Manabu Kai

Satoru Nogami

Toru Maniwa

Takashi Yamagajo

Kenji Kobae

Takatoyo Yamakami

Takayoshi Matsumura

Toru Okada

Noritsugu Ozaki

Kazuhisa Tsunoi

Mimpei Miura

Takashi Kanda

Kenji Fukuzono

Akira Fujii

Yasuyuki Oishi

Hiroyuki Hayashi

Toshihiro Kusagaya

Manabu Watanabe

Shunichi Kikuchi

Satoshi Emoto

Yuki Hoshino

Masumi Katayama

Takeshi Komiyama

Kiyoshi Fukui

Yasunori Sasaki

Hideo Miyazawa

Teruhisa Ninomiya

Makoto Suwada

Masateru Koide

Yoshikazu Hirano

Hidefumi Nishi

Noritsugu Osaki

Tatsuro Tsuneno

Kenzo Nishide

Yuichi Nakanishi

Wei Jie

Takayoshi Matumura

Yasushi Kasahara

Shigeru Gotou

Shinichi Tajima

A sensor device in which flexibility is ensured over the entirety of the device and that can be manufactured at low costs is provided. The sensor device having flexibility includes a flexible substrate, a temperature/humidity sensor connected to the flexible substrate, and an exterior body formed of a soft material. The temperature/humidity sensor has a waterproof moisture-permeable material that covers a detection surface. The exterior body has an opening that exposes the waterproof moisture-permeable material. The flexible substrate is bonded at at least a peripheral part thereof to the exterior body.

Sensor device

A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

Board and electronic device

Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Electronic equipment and beacon

An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.

RFID tag

A wiring board includes: a base member having stretchability; and a wiring including a plurality of conductive thread-like members that are sewn in the base member in a meandering manner and do not have stretchability.

Wiring board

An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.

RFID tag and manufacturing method thereof

A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

Multilayer substrate

A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Package mounting structure

A disclosed RFID tag includes: a base member; a semiconductor chip mounted on the base member; and an island-shaped reinforcing member covering the semiconductor chip and being configured to reinforce the base member. The reinforcing member has a side portion to which a recess is provided. The recess serves as an originating point of a fold line such that the fold line is formed away from the semiconductor chip when the reinforcing member is folded.

An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.

Electronic device and method for manufacturing same

An RFID tag including an inlay having a sheet-like shape and including an antenna and an IC chip electrically connected to the antenna, an outer covering member that covers the inlay, the outer covering member having a planar shape and including a main surface and a rear surface, and a frame part arranged on at least one of the main surface and the rear surface. The frame part is erected in a thickness direction of the outer covering member. The frame part surrounds the IC chip in a plan view.

A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

Semiconductor apparatus and manufacturing method thereof

An RFID tag includes a first flexible sheet covering a surface of a base part, an antenna and an IC chip; a second flexible sheet covering an another surface of the base part; a first reinforcing member including third and fourth sheets and covering the chip and a connecting portion of the chip and the antenna, the third sheet having flexibility and elasticity and being disposed on the first sheet, the fourth sheet having flexibility and being disposed on the third sheet; a second reinforcing member including fifth and sixth sheets and covering the chip and the connecting portion, the fifth sheet having flexibility and elasticity and being disposed on the second sheet, the sixth sheet having flexibility and being disposed on the fifth sheet; and an outer member having flexibility and elasticity and covering the first and the second sheets and the first and the second reinforcing members.

An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.

In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.

RFID tag manufacturing method with strap and substrate

Growing community of inventors

Kawasaki, Japan

Shunji Baba