Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Shunji Araki

Yoshihiko Nakamura

Tatsuya Arisawa

Yuki Inoue

Tomoaki Sawada

Tomoyuki Abe

Fumito Suzuki

Hiroki Tamiya

Hirohisa Goto

Hidetaka Kakiuchi

Yuki Miyoshi

Eiji Imaizumi

Kentarou Fujino

Takashi Shinpo

Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 &#x3bc;mol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 &#x3bc;m or less in ten-point average roughness Rz.

Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board

An epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.

Epoxy resin composition, prepreg, resin-coated metal foil, resin sheet, laminate and multilayer board

An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board

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Koriyama, Japan

Shunji Araki