Yamaichi Electronics Co., Ltd.

Fujitsu Corporation

Mitsui Petrochemical Industries, Ltd.

Kokusai Electric Co., Ltd.

Yamaichi Electric Mfg. Co., Ltd.

Hitachi-kokusai Electric Inc.

Shunji Abe

Toshio Soumiya

Kazumi Uratsuji

Tetsuhiko Miyatani

Hiromi Shigemoto

Akira Matsuda

Shizuo Shimizu

Hichiro Hayami

Noriyuki Matsuoka

Yuji Kato

Naotoshi Watanabe

Akinori Iwakawa

Kenzo Urabe

Ichiro Imaizumi

Masafumi Katoh

Michio Kusayanagi

Koji Yotsumoto

Jyoei Kamoi

Toshio Shimoe

Akio Yamamoto

Haruo Mukai

Hitoshi Kato

Akira Tanaka

Yuji Nomura

Yoshihiro Watanabe

Noboru Wakatsuki

Junichi Yamazaki

Tetsuo Tachibana

Yoshiharu Sato

Tetsuo Nishino

Osamu Isono

Toshimasa Fukui

Zhisheng Niu

Kazuo Hajikano

Eisuke Iwabuchi

Norihito Nishimoto

Shuuji Kunioka

Akio Ohdaira

Koso Murakami

Yuki Kudo

A correlation detection apparatus which realizes software CDMA inverse-spread processing. A reception circuit receives an RACH preamble from a mobile station, and an A/D converts the preamble into digital received data. An FFT unit FFT-processes the received data to obtain an FFT result. An RACH code storage unit holds an RACH preamble code, and another FFT unit FFT-processes the RACH preamble code to obtain another FFT result. A multiplication unit multiples the FFT result by the other FFT result. An IFFT unit IFFT-processes a result of multiplication input from the multiplication unit to obtain a delay profile. A data decoding unit decodes the received data by using the delay profile, and obtains decoded data.

Correlation detection apparatus and fourier transform apparatus

A CDMA mobile station apparatus receives a spread control signal including a non-orthogonal spread signal generated using a non-orthogonal spreading code which is non-orthogonal with a data signal spreading code and a spread data signal produced by spreading a data signal with a data signal spreading code from a base station apparatus via a radio link. The mobile station apparatus has a non-orthogonal spread signal generating unit for generating a non-orthogonal spread signal whose phase rotation caused by a radio transmission path is compensated for using a non-orthogonal spreading code, a subtracting unit for subtracting the generated non-orthogonal spread signal from the received signal to generate a difference signal, and a data signal demodulating unit for demodulating the difference signal into a data signal. The mobile station apparatus is capable of canceling an entire spread broadcasting signal, processing a band-limited signal, or processing a spreading code with a suppression coefficient.

CDMA mobile station apparatus

A rib is provided in a partition wall of a contact deviation member, so that when movable contact pieces in one contact terminal is apart from each other, the relative position of the movable contact piece in the one contact terminal is restricted to a movable contact piece in another contact terminal adjacent to the former pair.

Socket for semiconductor device

A despreading circuit which can reduce a circuit scale and power consumption is described. The circuit includes an A/D converter which converts a CDMA modulated analog signal to a digital signal of N bits, and a searcher which defects a synchronization phase from high-order small bits of the N bits and outputs synchronozation phase information to a control circuit. The control circuit transmits a signal for allowing despreading to be performed to a sliding correlator based on the phase information. The sliding correlator despreads the N bit digital signal outputted by the A/D converter and outputs the resulting correlation output as a despreading signal.

Despreading circuit

A despreading circuit which can reduce a circuit scale and power consumption is described. The circuit includes an A/D converter which converts a CDMA modulated analog signal to a digital signal of N bits, and a searcher which detects a synchronization phase from high-order small bits of the N bits and outputs synchronization phase information to a control circuit. The control circuit transmits a signal for allowing despreading to be performed to a sliding correlator based on the phase information. The sliding correlator despreads the N bit digital signal outputted by the A/D converter and outputs the resulting correlation output as a despreading signal.

An IC socket includes a moving plate capable of movement along an upper surface of a socket body. Contacts mounted in the socket body and external contact members arranged on an IC can be brought into and out of contact with each other through movement of the moving plate. The moving plate is capable of diagonal movement towards a corner portion along a diagonal line of the socket body.

IC socket

A burst transfer system realizes burst transfer between communication terminals in a communication network of the label multiplex system or the time-division multiplex type. In the burst transfer system, the communication terminal is so designed as to output a communication reservation request which is made up of destination information including the address of the transmitting side communication terminal and the address of the receiving side communication terminal, and band information representing the start time, the use band of the burst transfer, etc. The burst transfer system includes request receiving means for receiving the communication reservation request; communication request analyzing means for extracting destination information and the band information from the communication reservation request received by the request receiving means; path setting means for discriminating paths through which the transmitting side communication terminal and the receiving side destination are connectable to each other on the basis of the destination information; and band reserving means, if a path that satisfies a condition indicated by the band information exists in the paths which are discriminated by the path setting means, for reserving the path.

Burst transfer system

A device is provided for positioning an IC having a plurality of leads arranged in array along side surfaces of an IC body. The IC positioning device in an IC socket comprises a locator for pressing an outer side surface of a lead located on an extreme arraying end of the lead array group. The locator is moved while pressing side surfaces of leads which are displaced in an array direction, so that the lead array group and the IC body are moved to predetermined positions.

IC positioning device in IC socket

An IC pressing mechanism in an IC socket comprises a cover mounted in such a way to be able to move upwardly and downwardly with respect to a socket body, an IC pressing lever movable between a pressing position and a releasing position with respect to an IC package in accordance with upward and downward movement of the cover, such that, in the pressing position, the IC pressing lever urges an IC lead against a contact on a socket body, and a transmission lever for linking the cover and the IC pressing lever together. The transmission lever is connected at an upper end side thereof to the cover through a pin and rotatable inwardly and is outwardly about the pin. A lower end side of the transmission lever and an outer end side of the IC pressing lever are connected together through a pin. When the transmission lever are lowered in accordance with lowering of the cover, the pin connection portion between the lower end side of the transmission lever and the outer end side of the IC pressing lever is restricted in such a way to be caused to move downwardly and outwardly at the same time, and a pressing portion on an inner end of the IC pressing lever is caused to move upwardly and outwardly at the same time by the downward and outward movement of the pin connection portion.

IC pressing rotating lever mechanism IC socket

An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever is axially pivotably supported with respect to the socket body, an external end of the pressing lever being linked to the cover so as to be moved upwardly and downwardly in response to the upward and downward movement of the cover. An internal end of the pressing lever is moved upwardly and downwardly but in opposite directions in response to the upward and downward movement of the cover through a linking portion at the external end of the pressing lever so as to be brought into and out of engagement with an upper surface of the IC body or IC lead, thereby pushing down the IC body or IC lead or releasing the push-down force applied to the IC body or IC lead. The pressing lever is supported such that the pressing lever can slide forwardly and backwardly, and the pressing lever is moved outwardly so as to be spaced away from the IC body and IC lead when the external end of the pressing lever is caused to move downwardly by the downward movement of the cover through the linking portion.

In an ATM switching system responsive to a call setup request from each of B-ISDN terminals, a band for an accepted call is estimated in accordance with fuzzy decision on the basis of the fact that the network traffic characteristics can be determined empirically. Therefore, it is possible to estimate the band without any complicated band estimation calculations, improve the call acceptance processing response speed, and further improve the availability efficiency of the network transmission line. In the consequents of the fuzzy rules in particular, the respective band estimation values are represented by the respective input functions, or particularly by the linear couplings coupled by predetermined linear parameters of respective inputs, thus improving the descriptive capacity of the rules.

Connection admission control system

An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever being axially movably supported for inward end outward movement and pivotally supported for upward and downward movement with respect to the socket body. An external end of the pressing lever is linked to the cover such that the pressing lever can move upwardly and downwardly in response to the vertical upward and downward movement of the cover. An inner end of the pressing lever is moved inwardly and outwardly while moving upwardly and downwardly in response to but in a direction opposite to the upward and downward movement of the external end of the pressing lever, so as to be brought into and out of engagement with an upper surface of the IC lead, thereby exerting a push-down force against or removing the push-down force from the IC body or the IC lead.

A contact structure for an IC socket is usable for an IC package having a number of spherical type terminals or a number of cylindrical terminals arranged on the lower surface of an IC main body. To realize this contact structure for an IC socket, a number of contacts arranged corresponding to the spherical type terminals or the cylindrical terminals on the IC main body are provided. Resilient contact pieces for allowing each contact to come into pressure contact with each terminal at one point or at two points on the peripheral surface of the respective terminals are provided. Plural groups are constructed for a group of contacts and a group of terminals for changing an orientation of each resilient contact piece for allowing the group of contacts to give pressure contact force to the group of terminals in three directions or four directions. Each of the plural groups is arranged to generate an opposing force between adjacent groups.

Contact structure for IC socket

A contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a contacting portion supported by a resilient support element, and the contacting portion is arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point thereof. The contacting portion has a projection capable of pressing into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting an amount by which the projection presses into the spherical surface.

Contacting structure with respect to spherical bump

A structure for electrical connection of an electric part includes a contact probe retained in a through-hole formed in a base member such that the contact probe can be compressed into the through-hole in an axial direction of the through-hole and restored therefrom, and an intermediate contact member turnably supported by the base member through a cantilevered-arm interposed between the contact probe and a contactor of the electric part.

Growing community of inventors

Yokohama, Japan

Shunji Abe