Tokyo Institute of Technology

Seiko Epson Corporation

Tanaka Kikinzoku Kogyo K.k.

Shunichiro Ohmi

Juri Kato

Yasushi Masahiro

The present invention relates to a silicide alloy film that is formed on a substrate containing Si, the silicide alloy film including a metal M1 having a work function of 4.6 eV or more and 5.7 eV or less, a metal M2 having a work function of 2.5 eV or less and 4.0 eV or more, and Si, the silicide alloy film having a work function of 4.3 eV or more and 4.9 eV or less. Here, the metal M1 is preferably Pt, Pd, Mo, Ir, W or Ru, and the metal M2 is preferably Hf, La, Er, Ho, Er, Eu, Pr or Sm. The silicide alloy film according to the present invention is a thin-film which has excellent heat-resistance and favorable electrical property.

Silicide alloy film for semiconductor device electrode, and production method for silicide alloy film

A method of manufacturing a semiconductor device, comprises; a) forming a SiGe layer on a substrate; b) forming a Si layer on the SiGe layer; c) forming a groove that exposes the side surface of the SiGe layer by partly etching the Si layer and the SiGe layer; and d) forming a hollow portion between the substrate and, the Si layer by etching the SiGe layer via the groove. Step d) further comprises: forming a part of the hollow portion by supplying a new liquid including a fluorinated nitric acid solution to the substrate and etching the SiGe layer, removing the fluorinated nitric acid solution once from the hollow portion that is under formation; and etching the SiGe layer by refilling a new liquid including a fluorinated nitric acid solution to the hollow portion.

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Tokyo, Japan

Shunichiro Ohmi