Sumitomo Electric Industries, Limited

Shunichi Yoneyama

Hisao Go

Hiromi Nakanishi

In the method of making an optical module in accordance with the present invention, an optical module principal portion is molded by means of a molding die. The molding die has a ferrule accommodating portion f or accommodating a ferrule and a positioning portion which are located on its lead frame-mounting surface. The method of making an optical module comprises the steps of: preparing a lead frame having an alignment portion enabling the positioning with respect to the mold die; preparing the optical module principal portion; aligning the optical module principal portion with the lead frame and securing them to each other by means of a positioning jig so that the ferrule secured to the optical module principal portion meets the ferrule accommodating portion of the molding die; placing the lead frame with the optical module principal portion secured thereto on the molding die; and resin-molding the lead frame and the optical module principal portion by means of the molding die.

Optical module and a method of fabricating the same

An optical module which can reduce its size, and a method of making the same are provided. The optical module has a substrate, a carbon-coated optical fiber, a ferrule, and an optical device. The substrate has first, second, and third regions along an axis, and also has a ferrule support groove in the first region, an optical fiber support groove in the second region, and a device mount portion in the third region. The carbon-coated optical fiber is mounted in the optical fiber support groove. The ferrule covers the side face of the optical fiber and is secured to the ferrule support groove. The optical device is mounted at the device mount portion and is optically coupled to the carbon-coated optical fiber.

The optical module comprises a substrate consisting of single member. This substrate can mount an optical fiber, a ferrule, and a semiconductor optical device. The substrate has first, second, and third regions successively arranged along a predetermined axis. The substrate also has a ferrule support groove, an optical fiber support groove, and a device mount portion. The ferrule support groove is formed in the first region and extends along the predetermined axis. The optical fiber support groove is formed in the second region and extends along the predetermined axis. The device mount portion is formed in the third region. The semiconductor optical device is provide to be optically coupled to the optical fiber.

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Kanagawa, Japan

Shunichi Yoneyama