Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Shunichi Soma

Yusuke Nasu

Kiyofumi Kikuchi

Shuichiro Asakawa

Yuichi Suzuki

Kenya Suzuki

Seiji Okamoto

Ken Tsuzuki

Tetsuro Inui

Shuto Yamamoto

Osamu Moriwaki

Keita Yamaguchi

Hideki Nishizawa

Seiki Kuwabara

Shin Kamei

Motohaya Ishii

Shigeo Nagashima

Tomohiro Nakanishi

Hiroshi Fukuda

Shinji Mino

Takashi Saida

Ikuo Ogawa

Yuriko Kawamura

Mitsuo Usui

Satoru Konno

Teruaki Sato

Motoki Minami

Hiroshi Tomita

Masahiro Yanagisawa

Ryoichi Kasahara

Atsushi Aratake

Takashi Goh

Takashi Yamada

Hiroshi Terui

Masayuki Okuno

Fumito Nakajima

Yasuaki Hashizume

Fumihiro Ebisawa

Mitsuru Nagano

Keiichi Morita

Atsushi Murasawa

Takanori Ishikawa

Hiroki Kawashiri

Akira Komiyama

Takashi Nakayama

Yoshiteru Jinnouchi

A high-performance optical and electronic integrated switch capable of effectively extending the transmission distance includes a network processor that controls the functions of the packet switch, a plurality of optical transceivers provided near the processor and having a photoelectric conversion function, and an optical relay switch. A plurality of optical waveguides are connected to the input and output sides of the optical relay switch. Each optical transceiver has a regeneration function that performs optical-electrical conversion on inputted optical signals, then turns back the converted signals, and performs signal conversion on them, and its input side is connected with a routing optical waveguide included in the optical waveguides on the output side of the switch and its output side is connected with a routing optical waveguide included in the optical waveguides on the input side of the switch. The optical waveguides include ones for connecting to an external communication counterpart.

Optical and electronic integrated switch

In a pipe structure in which an optical fiber passes, miniaturization of the optical module in the longitudinal direction of the optical fiber is prevented. In the optical module according to the present invention, a holding structure of the optical fiber necessary to adopt the pipe structure is moved to a cover extension unit of the package. The optical fiber is adhered and fixed to the cover extension unit protruding from the cover body unit of the package to ensure protection of the optical fiber, and the optical waveguide chip is disposed to be closer to an inner wall of a side surface of the package. By disposing the optical waveguide chip to be close to the inner wall of the package as much as possible and reducing the mounting area in the package to the utmost, it is possible to realize miniaturization of the entire optical module.

Optical module

An optical and electronic integrated switch includes a network processor that controls the functions of the packet switch, a plurality of optical transceivers having photoelectric conversion functions, and a plurality of optical switches. The optical switches include different types of optical core switch and a plurality of optical-path selection switches. The optical transceivers provided near the processor have a regenerative relay function that regenerates optical signals and turns back the optical signals, and perform optical communication with a communication counterpart via the optical switches. In the optical communication, optical switches of the different types can cooperate to set paths for optical cut-through in which path selection is performed such that inputted optical signals are outputted without the intervention of the processor. This optical cut-through can be effectively performed without imposing a signal processing burden that consumes electric power on the processor.

A photonics-electronics convergence switch with which, even if an optical network system is built by combining a plurality of packet switches, the amount of processing in the packet switches does not increase, the optical network system operates with low electric power consumption, and this enables wide-range optical communication between the nodes of a communication origin and of a communication partner, includes a network processor that is an electronic circuit configured to control the functions of the packet switch, a plurality of optical transmitter-receivers having photoelectric conversion functions, and a plurality of optical switches. Different types of optical switches cooperate to select a path through which inputted optical signals or optical signals inputted from a different packet switch connected to the packet switch are outputted to a different packet switch without passing through the processor and a path through which inputted optical signals or optical signals inputted from a different packet switch pass through the processor and are subjected to photoelectric conversion.

A photo-electron fusion switch that can perform optical communications without any trouble, even when nodes of a communication source and a communication partner that are large in transmission capacity are connected, and makes it possible to realize a concentrated arrangement of devices having similar functions and reduce the communication processing time is connected to communication source's information processing devices and communication partner's information processing devices and information processing devices that are each different in transmission speed so as to configure an optical network system. The photo-electron fusion switch includes a network processor of an electronic circuit for controlling packet switch functions, a plurality of optical transmitter/receivers that can support coherent communications and has a photoelectric conversion function capable of transmitting and receiving optical signals different in transmission speed, an optical line switching device, and a plurality of multiplexing/separators. Each multiplexing/separator simultaneously transmits and receives respective optical signals different in transmission speed to and from the nodes via optical waveguides.

Optical and electronic integrated switch and optical network system

An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate.

An optical module with optical fibers is intended to be able to be easily sucked and conveyed, and mounted on another substrate. An optical module of the present disclosure includes an optical device to which optical fibers are optically connected; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, and a part of the optical device and a part of the optical fibers are adhesively fixed on a surface of the adhesive layer. The optical device may include ball grid array shaped electrodes. The carrier may be provided with a plurality of holes.

To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.

An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.

An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.

Optical device having a fiber array, and method of alignment thereof

An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.

In the case of implementing a polarization separation circuit, a polarization rotator, and the like by inserting a thin-film element into a substrate in one optical interference circuit, one common large-sized groove shared among a plurality of thin-film elements for their insertion has been formed. The optical waveguide type device of the present invention is configured such that at least one groove intersects only one corresponding optical waveguide for inserting the thin-film element and does not intersect other optical waveguides adjacent to the one corresponding optical waveguide. This groove substantially has a rectangular shape, and has a minimum size adapted to the thin-film element to be inserted so as to stably hold and fix the thin-film element in the groove. Adjacent grooves are formed so as to be arranged such that their portions in a direction substantially vertical to the optical waveguide are facing each other.

Optical waveguide device

In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.

Solder joint structure of flexible printed circuit board

An objective is to provide an integrated optical module which can avoid positional change and separation of a PLC chip when humidity changes. Provided is an integrated optical module characterized in that the integrated optical module includes: a PLC chip; a seat bonded and fixed to part of a lower surface of the PLC chip with an adhesive which is applied to an adhesion surface of the seat; and a support portion supporting the seat, in which a water-repellent treatment portion is provided by masking an upper portion of the support portion with a water-repellent material. The water-repellent treatment portion is provided only around the seat for a predetermined width. The water-repellent treatment portion is provided around the seat for a width of 100 &#x3bc;m or more.

Integrated optical module

A microlens array, which maintains high positional accuracy with respect to an optical circuit such as a waveguide and facilitates connection operation, and an optical transmission component including the microlens array. Solution The microlens array is provided with a plurality of microlenses arranged in an array structure and having the same length in the optical axis direction and optical fibers for alignment arranged at both ends of the array structure so that the optical axis is parallel to the optical axis of the microlens and having a length in the optical axis direction the same as the length of the microlens and a guided mode diameter smaller than an aperture of the microlens.

Growing community of inventors

Atsugi, Japan

Shunichi Soma