Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Shunichi Numata

Noriyuki Kinjo

Koji Fujisaki

Takao Miwa

Kunio Miyazaki

Takayoshi Ikeda

Hisae Shimanoki

Akio Mukoh

Nobuyuki Hayashi

Seiji Tai

Shigeru Hayashida

Yasushi Iwakabe

Osamu Miura

Akio Takahashi

Hitoshi Yokono

Kazuji Yamada

Toshikazu Narahara

Satoru Ogihara

Hiroshi Suzuki

Susumu Era

Junji Mukai

Yoshiaki Okabe

Kooji Fujisaki

Kunihiko Nishi

Takashi Yokoyama

Yutaka Sugita

Yoshiharu Nagae

Hiroshi Watanabe

Ken Takahashi

Hideo Suzuki

Tadahiko Miyoshi

Setsuo Kobayashi

Kanji Otsuka

Yoshio Sato

Tasao Soga

Fumiyuki Kobayashi

Masao Suzuki

Toshio Miyamoto

Hisao Yokokura

Teruo Kitamura

Hirokazu Inoue

Daisuke Makino

Shigeo Amagi

Ryuji Watanabe

Kishiro Iwasaki

Yasuhiko Kando

Akio Nishikawa

Toru Koyama

Hiroichi Shinohara

Tadanori Segawa

Masahiko Sakai

Mina Ishida

Kazuo Goto

Morimichi Umino

Takeshi Komaru

Mineo Nakano

Tadao Nakata

Yasuo Hanawa

Koo Honjo

Tadashi Muroi

Yukio Okoshi

Mikio Manabe

Masahiro Kitamura

Rie Tawata

Yasuhiro Mizuno

Katuyuki Funahata

Ikeda Takayoshi

A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

Photosensitive resin composition containing a carboxylic acid polymer,

A superconducting magnet coil, an insulating layer, and a superconducting magnet which do not generate quenching under cooled and operational conditions are provided by using a fixing resin capable of suppressing microcrack generation in a resin layer which causes quenching. A superconducting magnet coil manufactured by winding a superconducting wire and fixing the wire with resin and a method for manufacturing thereof, wherein said resin is a low cooling restricted thermal stress and high toughness fixing resin having a release rate of elastic energy G.sub.IC at 4.2 K. of at least 250 J.multidot.m.sup.-2, and/or a stress intensity factor K.sub.IC of at least 1.5 MPa.multidot..sqroot.m, and/or a stress safety factor at 4.2 K. of at least 3, and an allowable defect size at least of 0.3 mm. The superconducting magnet coil manufactured in accordance with the present invention does not cause quenching because microcracks are not generated in said resin when the coil is cooled to the liquid helium temperature, i.e. 4.2 K., and under an operational condition.

Superconducting magnet superconducting magnet coil, and manufacturing

Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

Method for forming multilayer wiring construction

An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Mounting substrate

There are disclosed a novel naphthalocyanine derivative represented by the general formula [I] or [II] shown below, a process for preparing said derivative, an optical information recording medium using said derivative, and a process for preparing thereof: ##STR1## wherein M is a metal, metal oxide, metal hydroxide and the like, R.sup.1 is an alkyl group of 1-22 carbon atoms, n is an integer of 1 to 4, and Y.sub.1 and Y.sub.2 aryloxy group and the like.

Naphthalocyanine derivative and production process thereof, as well as

A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor into polyimide. The improvement is imidizing the precursor by means of a chemical imidizing reagent. Typically a film of polyimide precursor is formed on a substrate, and mask which is negative with respect to the desired pattern is formed on the film. The film is contacted through the mask with a chemical imidizing reagent to effect imidization of unmasked portions, thereby forming polyimide. The mask and masked portions of the film are removed, leaving the desired polyimide pattern. High temperatures and harmful etchants can be avoided.

Process of forming a patterned polyimide film and articles including

Polyimides represented by general formula (I), (wherein Ar.sub.1 and Ar.sub.2 each represents an aromatic ring-containing group, Cf represents a fluorinated alkyl group directly bonded to Ar.sub.1, and m.gtoreq.1), and polyamide acids as their percursors. The polyimides have excellent humidity resistance and heat resistance, thus being useful as coating materials for semiconductor chips and insulating films for multi-layered wiring. ##STR1##

Fluorine-containing polyamide acid and polyamide

An acid dianhydride complex which is characterized in anti-hydrolysis, good stability, and high solubility in an organic solvent, is prepared by a reaction of a basic organic compound having a donor number of at least 20 and being free from an active hydrogen atom in the molecule and a carboxylic dianhydride compound.

Acid anhydride complex and process for producing same, and composition

The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

Process for producing metal-polyimide composite article

A metal naphthalocyanine derivative and process for producing said derivative which is represented by the following formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group).

Metal naphthalocyanine derivative and process for producing the same

A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.

Semiconductor chip module

Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 .mu.m or less. In the course of production of said resin encapsulated electronic devices, no crack is produced in the electronic devices by the stress from the outside, and after production, said resin encapsulated electronic devices are amazingly lessened in formation of cracks by thermal stress and have high reliability.

Resin encapsulated electronic devices

Disclosed are an electrophotographic plate comprising a photoconductive layer containing an organic photoconductive substance on an electroconductive support, characterized in that said photoconductive layer has a film containing as the organic photoconductive substance a metal naphthalocyanine derivative represented by the formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group), a metal naphthalocyanine derivative defined above and a process for producing the same.

Electrophotographic plate by use of metal naphthalocyanine derivative

In a process for forming a wiring conductor of Cu, Al, Au or the like on a wiring substrate, polyimide-based resin having the following unit structural formula is used as a lift-off material. ##STR1## wherein R.sub.1 : ##STR2## R.sub.2 : ##STR3## n is an integer of 15,000 to 30,000. This lift-off material has very good etching susceptibility and can be selectively lifted off with an etching solution of a mixture of hydrazine and ethylene diamine from a lower polyimide layer having R.sub.1 : ##STR4## R.sub.2 : ##STR5## .

Process for forming wiring on substrate

A liquid crystal display element comprising a pair of substrates, a pair of electrodes provided on the respective substrates, at least one of which is transparent and a liquid crystal layer disposed between said substrates, the liquid crystal layer comprising a nematic liquid crystal, which exhibits a positive dielectric constant anisotropy and contains an optically active substance, the liquid crystal moleccule orientation direction in the liquid crystal layer is twisted in the range of 200.degree. to 250.degree. from the one substrate surface toward the other substrate surface so as to form a helical structure therein. A polyimide orientation film is provided between the electrodes and the liquid crystal layer. The polyimide orientation film is one made of a polyimide prepared by reacting a diamine compound having a long-chain hydrocarbon group or a diamine compound having a trifluoromethyl group with a tetracarboxylic dianhydride and causes a pretilt angle of at least 3.degree. relative to the nematic liquid crystal molecules. The liquid crystal display element of the present invention is free from a scattering domain.

Liquid crystal polyimide alignment free of scattering domains

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Hitachi, Japan

Shunichi Numata