Agilent Technologies, Inc.

Shunichi Ishikawa

Akira Takekuma

A light-emitting diode with which the LED chip will not be destroyed comprises an LED chipmounted on plate-shaped wiring meansinside a light-emitting diode. Wiring meanscomprises conductive pathsandthat electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive pathsare connected electrically to LED chip, extending from the position where the LED is mounted to leadsand, to which they are connected by soldering. LED chipis supported by being held inside concave partin one leadat this time.

Method of producing a light-emitting diode

A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip mounted on plate-shaped wiring means inside a light-emitting diode. Wiring means comprises conductive paths and that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths are connected electrically to LED chip extending from the position where the LED is mounted to leads and to which they are connected by soldering. LED chip is supported by being held inside concave part in one lead at this time.

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Kanamori Machida, Japan

Shunichi Ishikawa