Fujifilm Corporation

Fuji Photo Film Company, Limited

Shunichi Hosaka

Hiroshi Maeda

Kazuhiro Nishida

Yoshihisa Negishi

Eiji Watanabe

Masatoshi Yasumatsu

Masayoshi Nagata

Yukiyoshi Ishii

Hiroyuki Kurabayashi

Jun Inose

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.

Solid-state imaging device and method for manufacturing the same

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low &#x3b1;-ray glass.

It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Solid-state imaging device and method of manufacturing said solid-state imaging device

There are provided a semiconductor substrateon which solid-state imaging devices are formed, and a translucent memberprovided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrateto a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate

Solid-state imaging device and method of manufacturing the same

An improvement of a photographic film roll composed of a spool which has a spool core having a slit therein and a flange at both ends of the spool core and a photographic 120-size film which is placed and fixed on a continuous light-shielding backing paper in which one end of the backing paper is inserted into the slit of the spool and other portion of the backing paper is wound on the spool to form multiple convolutions, resides in that the backing paper has at the center in its longitudinal direction a width less than the distance between the two flanges measured at the position of &frac12; of height of the flanges and has two wide areas of at least 10 cm long one of which is within 50 cm area measured from its one end and another of which is within 50 cm area measured from its another end, the width of each wide area being larger than the distance between the two flanges measured at the tops of the flanges.

Photographic 120-size film roll

A peel-apart type instant film unit comprising an image receiving sheet separably adhered in a heat sealing manner to a mask member which is peeled apart from the former after the development thereof. There is provided therebetween a weak sealing layer comprising an adhesive layer of a thermoplastic polymer having hydrophilic groups and a separating layer which is alkali resistant and has a good separation property relative to the adhesive layer. The weak sealing layer can provide an easy separation between the separating and adhesive layers so as perfectly to transfer the adhesive layer to the image receiving sheet to provide a fine appearance and a writeable image frame on the image receiving sheet. The mask member is made of any polyethylene compounded paper sheets and is provided with a processing liquid-resisting layer inside the weak sealing layer for the purpose of preventing the permeation of processing liquid thereto.

Growing community of inventors

Kanagawa, Japan

Shunichi Hosaka