Canon Kabushiki Kaisha

Mitsubishi Denki Kabushiki Kaisha

Konishiroku Photo Industry Co., Ltd.

Renesas Technology Corp.

Ricoh Company, Ltd.

Mitsubishi Electric Corporation

Renesas Electronics Corporation

Ryoden Semiconductor System Engineering Corporation

Shunichi Abe

Akira Yamazaki

Yoshihiro Tomita

Naoto Ueda

Naoki Izumi

Yoshirou Nishinaka

Tetsuya Uebayashi

Hideyuki Ichiyama

Takuma Nakamura

Masafumi Yamada

Yuichi Aoyama

Tetsurou Sasamoto

Mitsuo Akiyama

Akio Suzuki

Tadashi Yoshida

Yoshinori Ikeda

Yoshihiro Takada

Masaharu Ohkubo

Yoshinobu Mita

Kimiyoshi Hayashi

Nobuo Matsuoka

Toshio Takeuchi

Takanori Inadome

Mistuo Akiyama

Kazuya Nagao

Katsuyuki Fukutome

Yukimichi Someya

Yasuo Katano

Naoto Kawamura

Nao Nagashima

Kazuyuki Nakagawa

Takashi Sugiura

Yoshihiro Kashiba

Mitsuo Hasebe

Makoto Kimura

Michitaka Kimura

Yoshihiko Kudo

Yukinobu Tarui

Ryuichiro Mori

Tatsuhiko Akiyama

Fumio Iwai

Hiroshi Kuru

Goro Izuta

Kazuho Shimoda

Takumi Nagamine

Seizou Ohumae

Katunori Asai

Seizo Ohmae

Masaaki Namatame

Yamada Masafumi

A microwave module includes a plurality of microwave devices and a microwave module substrate. Each of the plurality of microwave devices exchanges a signal with a corresponding one of a plurality of antenna elements. The microwave module substrate includes a mounting surface on which the plurality of microwave devices are mounted. The microwave module substrate is electrically connected to each of the plurality of antenna elements. The mounting surface is perpendicular to a plane surface on which the plurality of antenna elements are arrayed.

Antenna

To provide a semiconductor device having improved reliability. A method of manufacturing a semiconductor device according to one embodiment includes a step of cutting, in a dicing region arranged between two chip regions adjacent to each other, a wafer along an extending direction of the dicing region. The dicing region has therein a plurality of metal patterns in a plurality of columns. In the step of cutting the wafer, one or more of the columns of metal patterns formed in a plurality of columns are removed, and the metal patterns of the column(s) different from the above-mentioned one or more of the columns are not removed.

Method for manufacturing semiconductor device

A disclosed fixing device applying a bubble-like fixing liquid to resin-containing particles adhered to a medium so that the resin-containing particles are fixed to the medium, the bubble-like fixing liquid being formed by transforming a fixing liquid into foam that dissolves or swells at least a part of the resin, includes a control device that, based on a difference between a moisture content included in the medium after fixing and a target value of the moisture content, adjusts an application amount of the fixing liquid for a next medium.

Fixing device, image forming apparatus, and fixing method

A fixing device includes a foam fixer generator unit generating a foam fixer containing a softener softening toner by dissolving or swelling part of resin of the toner, an application roller carrying and transferring the foam fixer onto a recording sheet, a pressure roller applying pressure to a toner image on the recording sheet via the foam fixer on the application roller to fix the toner image on the recording sheet, a cleaning device removing residual components remaining on the application roller, a recording sheet detector unit detecting presence or absence of the recording sheet, a remover unit being in contact with and separated from the application roller to remove the foam fixer on the application roller, and a control unit controlling the contact-separation operation of the remover unit based on a detected result of a front end and/or a rear end of the recording sheet.

Fixing device and image forming apparatus

A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.

A disclosed cleaning device for removing adhering matter from a surface of a member subject to cleaning includes a belt-shaped film member arranged in a stretched configuration capable of being wound or endlessly move in a direction opposite to a surface movement direction of the member subject to cleaning while being in contact with the surface of the member subject to cleaning, and a cleaning blade configured to abut on the surface of the member subject to cleaning via the belt-shaped film member at a position where the belt-shaped film member is brought into contact with the member subject to cleaning.

A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.

Method of attaching a semiconductor chip to a chip mounting substrate

In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.

Semiconductor apparatus utilizing a preparatory stage for a chip assembly

A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed to overlap in the range of height with the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, a wire connects the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wire. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

Semiconductor device

A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.

Lead frame

Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus

A semiconductor device and a manufacturing method for downsizing and densification achieved by reducing the thickness of the semiconductor device without an increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed overlapping in height the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, wires connect the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wires. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

An image processing system comprises a first input unit for inputting an image signal, a second input unit for inputting a character or code signal, a binarizing unit for binarizing the image signal, including a unit for gray level processing the image signal, a discrimination unit for discriminating the presence or absence of a gray level in the image signal, and an output unit for outputting the image signal when the discrimination unit discriminates the absence of the gray level or the character or code signal as a digital image signal without processing the signal by the gray level processing unit.

Image processing system

A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

Lead frame including frame-cutting slit for lead-on-chip (LOC)

A color image forming apparatus separately corrects an intensity of each of color component images used for forming a multicolor image. The multicolor image is formed by superimposing a plurality of color component images on a printing paper. Each of the color component images is formed by one of color toners. Color patterns having a gradation are printed by using each of the color toners. A color sensor is provided at a position in which each of the color patterns is read, the color sensor being sensitive to a color of each of the color toners. The color sensor outputs output signals corresponding to each of the color patterns. The intensity of each of the color component images is corrected in accordance with the corresponding output signals of the color sensor. A mixture of colors in each of the color component images is detected, and the intensity of the corresponding color component image is corrected so as to maintain a desired color balance.

Color image forming apparatus separately correcting each color component

Growing community of inventors

Tokyo, Japan

Shunichi Abe