Infineon Technologies Americas Corp.

Shunhe Xiong

Wayne Partington

Grant Maloney

A packaged power device includes a ceramic package body having a top drain pad having a first area, a top source pad having a second area smaller than the first area, and a top gate pad having a third area smaller than the second area; a power device having a bottom surface affixed to a top drain pad, a die source pad coupled to the top source pad, and a die gate pad coupled to the top gate pad; and a ceramic lid affixed to the ceramic package body to form the packaged power device.

System and method for a device package

A semiconductor package for mounting to a printed circuit board (PCB) includes a case comprising a ceramic base, a semiconductor die in the case, a mounting pad under the ceramic base and coupled to the semiconductor die through at least one opening in the ceramic base. The mounting pad includes at least one layer having a coefficient of thermal expansion (CTE) approximately matching a CTE of the ceramic base. The mounting pad includes at least one layer having a low-yield strength of equal to or less than 200 MPa. The mounting pad includes at least one copper layer and at least one molybdenum layer. The semiconductor package also includes a bond pad coupled to another mounting pad under the ceramic base through a conductive slug in the ceramic base.

Surface mount device package having improved reliability

A semiconductor package for mounting to a printed circuit board (PCB) includes a semiconductor die in a ceramic case, a conductive base coupled to the semiconductor die at a top surface of the conductive base, where the conductive base includes a first layer having a first coefficient of thermal expansion (CTE), and a second layer having at least one mounting tab and a second CTE. The conductive base is configured to reduce thermal stress in the ceramic case, where the first CTE is equal to or slightly different than a CTE of the ceramic case, the second CTE is greater than the first CTE, and a CTE of the PCB is greater than or equal to the second CTE. The conductive base is configured to electrically couple a power electrode of the semiconductor die to the PCB.

Growing community of inventors

Westford, MA, United States of America

Shunhe Xiong