Tamkang University

Other

Shung-Wen Kang

Kun-Cheng Chien

Meng-Chang Tsai

Ching-Bin Lin

Mau-Kuo Wei

A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Filling pipe for use in high-temperature heat pipe filling operation

A thermal spreader comprises: a casing having a first side contacted with a heat source and a second side secured with a heat sink, and having a vapor chamber defined in an interior in the casing; and a crosslinking capillary lattice retained in the casing and occupying the vapor chamber in the casing, whereby upon evacuation to form vacuum in the vapor chamber and filling of a vaporizable working fluid in the vapor chamber, the working fluid will be repeatedly vaporized and condensed through the crosslinking capillary lattice to absorb and remove heat from the first side of the casing and to dissipate heat outwardly from the second side of the casing.

Thermal spreader for simultaneously enhancing capillary effect and structural strength

A loop heat pipe with flat evaporator includes an evaporation section, a condensation section, and a transportation section connected between the evaporation section and the condensation section. The evaporation section includes a heat source, an enclosed containment structure, and a capillary structure. The enclosed containment structure is positionable on the heat source and forms an enclosed containment space which receives a working fluid and has a bottom in which a channel structure is formed and further forms a liquid inlet and a gas outlet in a circumferential wall thereof the container to respectively connect a liquid passage and a gas passage so that when the working fluid is heated by the heat source to become vapor, the vapor moves through the gas outlet and the gas passage to a condensing device provided in the condensation section where the vapor is cooled and converted back to the liquid form of the working fluid that is then guided through the liquid passage back to the enclosed containment space for next cycle.

Loop heat pipe with flat evaportor having a wick with an internal chamber

A LED lamp includes: a plurality of substrates juxtapositionally formed as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs when lit up, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat produced from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

LED lamp instantly dissipating heat as effected by multiple-layer substrates

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

High power LED lighting assembly incorporated with a heat dissipation module with heat pipe

A microfabrication process comprises the swelling of at least a hydrophilic polymer in order for shrinking each cavity size of a micromachined microstructure pattern from three-dimensional orientations, whereby upon filling or deposition of metal into each cavity of the pattern when performing an electroforming step, a supermini microstructure with slim, fine, thin and small size can be obtained as geometrically miniaturized from three-dimensional orientations.

Growing community of inventors

Taipei, Taiwan

Shung-Wen Kang