Hisense USA Corporation

Hisense International Co., Ltd.

Hisense Broadband Multimedia Technologies Co., Ltd.

Shun Zhang

Hao Wang

Hongwei Mu

YongLiang Huang

YungLiang Huang

Yongliang Huang

A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Connection structure for laser and laser assembly

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Optical component

A laser transmitter includes a heat sink, a laser disposed on the heat sink, and a connection apparatus. The connection apparatus includes: a lower substrate and an upper substrate disposed on the lower substrate. An upper surface of the lower substrate is disposed with a first conductor, and a lower surface thereof is disposed with a second conductor. The upper substrate has an upper surface disposed with a third conductor, where the third conductor is connected to the second conductor. The heat sink is disposed on a side of the lower substrate that is close to an end of the first conductor. The laser is connected to an end of the first conductor that is close to the heat sink.

Laser transmitter

Growing community of inventors

Shandong, China

Shun Zhang