Innolux Corporation

Shun-Yuan Hu

Tsau-Hua Hsieh

Li-Wei Mao

Ming-I Chao

Ker-Yih Kao

Shu-Ming Kuo

Chin-Lung Ting

Tung-Kai Liu

Hui-Chieh Wang

Tzu-Min Yan

Ming-Chang Lin

Liang-Lu Chen

Ming Chun Tseng

Ming-Chun Tseng

Chih-Yung Hsieh

Kung-Chen Kuo

Chun-Hsien Lin

Fang-Ying Lin

Kai Cheng

Yu-Hsin Liu

Kuan-Feng Lee

Yang-Chen Chen

Chia-Chi Ho

Yi-Hua Hsu

Wei-Cheng Chu

Bo-Feng Chen

Chia-Cheng Liu

Ming-Fu Jiang

Jen-Chieh Peng

Chia-Hsiu Hsu

M-Hua Hsu

An electronic device is provided, including a substrate and a plurality of electronic units disposed on the substrate. The substrate includes a first edge extending along a first direction and a second edge extending along a second direction. The electronic units include first, second, and third electronic units arranged adjacently along the first direction. The first electronic unit is closer to the second edge than the third electronic unit. A pitch between the second and third electronic units is greater than a pitch between the first and second electronic units. The electronic units include fourth, fifth and sixth electronic units arranged adjacently along the second direction. The fourth electronic unit is closer to the first edge than the sixth electronic unit. A pitch between the fourth and fifth electronic units is greater than a pitch between the fifth and sixth electronic units.

Electronic device

Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.

Electronic device and manufacturing method of electronic device

An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrate.

A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Light-emitting device and tiled display comprising the same

An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Electrical connection structure and electronic device comprising the same

Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process:

Methods for manufacturing a display device

An electronic device is provided, including a substrate, a plurality of bonding pads, and a plurality of light emitting members. The bonding pads are disposed on the substrate. The light emitting members are disposed on the bonding pads. The light emitting members include a first pair of adjacent light-emitting members, a second pair of adjacent light-emitting members, and a third pair of adjacent light-emitting members. The first pair of adjacent light-emitting members, the second pair of adjacent light-emitting members, and the third pair of adjacent light-emitting members are arranged along the first direction in sequence. The first pair of adjacent light-emitting members has a first pitch, the second pair of adjacent light-emitting members has a second pitch, and the third pair of adjacent light-emitting members has a third pitch. The third pitch is greater than the second pitch, and the second pitch is greater than the first pitch.

An electronic device including a driving circuit substrate, a plurality of light emitting units, and a first passivation layer is provided. The driving circuit substrate includes a plurality of active elements, the light emitting units are disposed on the driving circuit substrate, wherein each of the light emitting units is electrically connected to the corresponding active element. The first passivation layer covers the light emitting units. One of the active elements provides a first current to the corresponding light emitting element, such that the lighting efficiency of the light emitting units is ranged from 70% to 100%.

Electronic device with passivation layer covering a plurality of light emitting units and increased lighting efficiency

An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrates.

An electronic device including a driving circuit substrate, a plurality of light emitting units, and a first passivation layer is provided. The driving circuit substrate includes a plurality of active elements. The light emitting units are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate, and each of the plurality of light emitting units is five surfaces light emitting type. The first passivation layer covers the light emitting units and the driving circuit substrate for protecting the light emitting units. One of the active elements provides a current to a corresponding one of the light emitting units, such that lighting efficiency of the corresponding one of the light emitting units is ranged from 70% to 100%. The current includes a plurality of pulse currents spaced apart from each other, and time widths of the pulse currents are the same.

Electronic device with five surfaces light emitting units and passivation layer covering light emitting units and substrate

Electronic device and method for manufacturing the same

A light-emitting device is provided, including a light-emitting unit and an optical layer. The light-emitting unit includes a light-emitting chip and an encapsulation disposed thereon. The optical layer is disposed on the light-emitting unit, the optical layer having a first region overlapping the light-emitting chip in a top view direction of the light-emitting device and a second region not overlapping the light-emitting chip in the top view direction of the light-emitting device, wherein the transmittance of the first region is less than the transmittance of the second region.

Light-emitting device

Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.

Light-emitting diode package and electronic device

An electronic device including a driving circuit substrate and a plurality of light emitting units is provided. The driving circuit substrate includes a plurality of active elements, the light emitting units are disposed on the driving circuit substrate, each of the light emitting units is electrically connected to the corresponding active element, wherein one of the active elements provides a first current to the corresponding light emitting unit, such that lighting efficiency of the light emitting units are ranged from 70% to 100%.

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Miao-Li County, Taiwan

Shun-Yuan Hu