Industrial Technology Research Institute

Shun-Tien Lee

Cheng-Hung Tsai

Chiung-Hung Wang

Ying-Chih Chen

Kun-Yi Shen

Cheng-Ta Hsiao

Yi-Ming Chen

Chun-Hsing Lee

Cheng-Da Shaw

Min-Sheng Kao

Shin-Ge Lee

Yao-Ling Cheng

Chien-Chun Lu

Cheng Hung Tsai

Cherng-Shiun Wu

Min Sheng Kao

Chih-Li Chen

Chia-Hung Chiu

Chia Hung Chiu

Yen Chu

Chun-Sheng Lee

A light transceiver module is designed for electronic devices. It forms an electric connection with the electric connector of the electronic device. The light transceiver module contains a base, a light-emitting device for providing optical signals, a light-receiving device for receiving optical signals, and a main circuit board. The base supports the light-emitting device, the light-receiving device, and the main circuit board. The main circuit board has a pluggable electric connector for connections with the electric connector of the electronic device. The light transceiver module can be used to simplify and optimize the devices using it.

Light transceiver module

A hybrid electro-optical circuit board including a plate, a light guiding hole and a light-guide device. The light guiding hole is formed in the plate to be connected to an upper surface and a lower surface of the plate. The light-guide device is formed on the lower surface and covers and contacts the light guiding hole. An optical signal is transmitted between the light-guide device and the upper surface of the plate via the light guiding hole. A metal layer is further formed on an inner wall of the light guiding hole, to reduce the roughness of the inner wall and reflects the optical signal by the reflection characteristics of metal. Further, the light guiding hole is filled with a transparent substance to transmit the optical signal and to stop foreign material from entering the light guiding hole.

Hybrid electro-optical circuit board and method for fabricating the same

An array optical subassembly has a substrate, at least one optical active component, a driver IC, a circuit board and a cover covering the foregoing elements. The substrate has two opposite surfaces, wherein one surface is formed by a lens array and the other surface is formed by metal pads, lines and alignment keys. The optical active component has a source array aligned to the lens array when the optical active component is connected to the metal pads on the substrate. The driver IC and the circuit board are also connected to the metal pads on the substrate to drive the optical active component. The lens array is directly formed on the substrate so the source array is aligned to the lens array very well by the alignment keys when the optical active component connected to the substrate.

Array optical subassembly for array optical active component

An array optical sub-assembly includes a base seat, an integrated circuit, a transparent substrate and a photoelectric element. The integrated circuit and the photoelectric element are bonded respectively to the base seat and the transparent substrate. The base seat and the transparent substrate form a sealed space to protect the elements. The photoelectric element and the integrated circuit are separated to avoid thermal interference between the photoelectric element and the integrated circuit. Therefore total performance is increased and fabrication difficulty is reduced.

Array optical sub-assembly

An optoelectric converting substrate includes a substrate, at least one honeycomb-shaped micro-structured optical waveguide embedded in the substrate and having two ends exposed through the substrate, a plurality of optoelectronic elements disposed on the substrate and coupled with the two ends of the honeycomb-shaped micro-structured optical waveguide, and a plurality of IC driving elements disposed on the substrate and electrically connected with the optoelectronic elements by conductive wires to drive the optoelectronic elements such that optical signals are transmitted through the honeycomb-shaped micro-structured optical waveguide. The optoelectric converting substrate can be easily fabricated at a low cost and effectively increases the displacement tolerance of the optoelectronic elements in substrate packaging.

Optoelectric converting substrate

An optical transmitter module includes light-emitting devices with coaxial type packaging. Coplanar anode and cathode electrodes of one light-emitting device are mounted on a substrate so that heat generated from the light-emitting device can be effectively dissipated through the substrate. Furthermore, the direct electric connection between the light-emitting device and the substrate eliminates the requirement of wire boding for electric connection, increasing the performance of the optical transmitter module in high speed signal operation.

Optical transmitter module

An extending latch mechanism for a pluggable optical module includes a resilient member and a lever coupling with each other. The lever is turnable to drive and deform the resilient member and to retract the resilient member transversely in the optical module so that the optical module may be removed directly. The structure is simple and easy to fabricate and assemble. It is reliable and convenient to use.

Extending latch mechanism for a pluggable optical module

An assembly apparatus for an optical transceiver has a positioning device and an assembly device. The assembly device has a base, a transverse adjustment mechanism adjustably mounted on the base, a clamping mechanism mounted on the transverse adjustment mechanism for clamping a control circuit board, a height adjusting mechanism adjustably mounted on the transverse adjustment mechanism, a longitudinal adjustment mechanism adjustably mounted on the height adjusting mechanism and element holding mechanism adjustably mounted on the longitudinal adjustment mechanism for holding a optical element. Accordingly, an optical transceiver can be conveniently assembled and tested with the assembly apparatus.

Assembly apparatus for an optical transceiver

A latch mechanism for a pluggable optical module includes a boss in contact with a datum plane of a latch trough to latch and anchor the optical module. When a lever is turned, the boss is turned to press the datum plane and change the relative position to move a sliding member and release the latched and anchored condition of the optical module. The structure is simple and easy to fabricate and assemble. It also is reliable and convenient.

Growing community of inventors

Hsinchu, Taiwan

Shun-Tien Lee