Asm Assembly Automation Limited

Shun Ming Kenneth Fung

Wing Hong Leung

Kwok Kee Chung

Fan Wang

Chi Leung Vincent Mok

Chi Kit Ronald Chung

Jun Cheng

Ka Fai Fung

Y Edmund Lam

An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

Vision system for positioning a bonding tool

A system for three-dimensional reconstruction of a surface profile of a surface of an object is provided that utilizes a binary pattern projected onto the surface of the object. A binary string consisting of a series of '1's and '0's is first created, and a binary pattern of light that is constructed in accordance with the binary string such that bright and dark bands of light of equal widths correspond to &#x201c;1&#x201d;s and &#x201c;0&#x201d;s from the binary string respectively is projected onto the surface. The binary pattern is shifted with respect to the surface multiple times, during which an image of the binary pattern illuminating the surface is obtained at each position of the binary pattern. Thereafter, a height of each predetermined point on the surface is calculated relative to a reference plane based upon the images cumulatively obtained at said predetermined point.

Imaging system for three-dimensional reconstruction of surface profiles

Growing community of inventors

Hong Kong, China

Shun Ming Kenneth Fung