Motorola Corporation

Freescale Semiconductor,inc.

Nxp Usa, Inc.

Shun-Meen Kuo

Christopher K Chun

Michael S Lebby

Davis H Hartman

Lianjun Liu

Li Li

Kent W Hansen

Gary F Witting

Jenn-Hwa Huang

Treliant Fang

Barbara M Foley

Darrel R Frear

Howard M Berg

Melissa E Grupen-Shemansky

Lei L Mercado

David Galloway

Sankaranarayanan Ganesan

Marcel N Tutt

A method of determining the intrinsic electrical characteristics of a device under test (DUT) includes determining a set of test measurements for a test structure including the device and determining test measurements for a number of de-embedding test structures. Based on the test measurements, DUT measurements are determined using both open-short and three-step de-embedding processes. The DUT measurements are combined to determine an imperfection error, which is used to adjust the calculations of a four-port de-embedding method. The adjusted calculations provide for a more accurate measurement of the parasitic elements in the test structure, thereby improving the determination of the intrinsic electrical characteristics of the device.

Device under test de-embedding

A micro-electro-mechanical device ( ) including a shorting bar ( ) having a first portion ( ) electrically coupled to a first input/output signal line ( ) and a second portion ( ) electrically uncoupled to a second input/output signal line ( ). Shorting bar ( ) is coupled to a moveable end ( ) of a cantilever structure ( ). Thus, preferably only the second portion ( ) of shorting bar ( ) needs to be actuated to be electrically coupled to the second input/output signal line ( ).

Micro-electro-mechanical device and method of making

An electronic component includes a substrate ( ), a device ( ) supported by the substrate and including a first bond pad ( ), and a cap ( ) overlying the substrate. The cap includes a second bond pad ( ) at an outside surface of the cap, a third bond pad ( ) at an inside surface of the cap and electrically coupled to the first bond pad, and an electrically conductive via ( ) extending through the cap and electrically coupling together the second and third bond pads.

Electronic component and method of manufacture

An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Nonconductive laminate for coupling substrates and method therefor

A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Optical interface unit with detachable photonic device

A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).

Optoelectronic interface module

Method for making optical interface unit with detachable photonic device

A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.

Optical interconnect unit and method or making

A credit card pager having a casing surrounding a substrate and electronic circuitry mounted on the substrate. An information connection including at least one molded waveguide having a core with a photonic device mounted at one end and a second end of the core being positioned on the substrate to be accessible exterior of the casing so as to communicate optical information signals therethrough.

External communication link for a credit card pager

Method of making an optoelectronic interface module

A molded reflective optical waveguide module is provided. A molded first optical portion having a fist surface or a major surface is formed. A core region having a first end and a second end is disposed into the first surface of the molded first optical portion with the first end of the core region terminating in a surface having an angle. A second molded optical portion having electrical traces and photonic devices can be applied to the molded first optical portion.

Molded reflective optical waveguide

An article and a method for making contact areas (221, 222, 230) on an optical waveguide (100, 200) are provided. A waveguide (100, 200) having a first surface (112) and a second surface (113) with a first indent (101) located on the first surface (112) and a second indent (102) located on the second surface (113) and a groove (104) is made interconnecting the first and second indents (101, 102). A low temperature melting member (111) is placed in the first indent (101) on the first surface (112) and is melted, thereby flowing the low temperature melting member into the groove (104) and into the second indent (102) located on the second surface (113).

Method of making contact areas on an optical waveguide

An interconnect substrate (116) having a surface (105) with a plurality of electrical tracings (115) disposed thereon. A photonic device (114) having a working portion (118) and having a contact (106) electrically coupled to one of the plurality of electrical tracings (115) disposed on the interconnect substrate (116). A molded optical portion (112) that encapsulates the photonic device (114) is formed. The molded optical portion (112) forms a surface (120). The surface (120) passes light between the photonic device (114) and an optical fiber(103). Alignment of optical fiber 103 is achieved by an alignment apparatus (117) that is formed in the molded optical portion (112).

Optoelectronic interface and method of making

A substrate (102) having a surface (103) with a plurality of electrical traces (106) disposed thereon is provided. A photonic device (111) is operably mounted on the electrical traces (106) of the substrate (102). An optical portion (121) having a reflective surface (118) that is embedded in the optical portion (121) for directing light to and from the working portion of the photonic device (111) is disposed on the surface (103) of the substrate (102), thereby encapsulating the photonic device (111) in the optical portion (121).

Optoelectronic interface device and method with reflective surface

A first molded optical portion having a major surface with a free space and a first and a second plurality of core regions are disposed on the major surface of the first optical portion. A first and a second plurality of ends of the first and the second plurality of core regions are located at a first and a second end surfaces of the molded optical portion. A free space area is located between the first and the second plurality of core regions.

Growing community of inventors

Chandler, AZ, United States of America

Shun-Meen Kuo