Sun Microsystems, Inc.

Convex Computer Corporation

Shun-lung Chao

Louis W McEwin, Jr

A heatsink for dissipating thermal energy generated by a microprocessor and neighboring peripheral components. The heatsink is affixed to a printed circuit board within a computer housing. The heatsink includes a thermally conductive base, a plurality of thermally conductive fins, and a heat pipe. The thermally conductive base includes substantially planar upper and lower surfaces displaced from each other by a thickness of the base. The base defines a first channel, proximal to the lower surface, extending from a first end of the base to a second end. The plurality of conductive fins extends substantially perpendicularly from the upper surface of the base. Each of the plurality of fins includes substantially planar proximal and distal major surfaces displaced from each other by a thickness of the fin. The heat pipe is contained within the first channel. The heat pipe includes an elongated casing containing a heat transfer medium and a wick. The wick is immersed in the medium extending along a major access of the heat pipe. The heatsink is configured to be affixed to the printed circuit board with the heat pipe aligned over the center of the microprocessor and the lower surface of the heatsink in close proximity with an upper surface of the microprocessor.

Heatsink with embedded heat pipe for thermal management of CPU

A heat transfer assembly 11 is disclosed for transferring heat from a heat generating electronic device 15 or computer chip to ambient air. The heat transfer assembly 11 is comprised of a heat pipe 20 mounted perpendicular to a heat generating electronic device 15. The heat transfer assembly 11 is designed to provide a mechanically solid support for the bonding of the various heat transfer assembly components and to use circumferentially mounted fins 23 to increase the efficiency of heat transfer away from the electronic devices 15. The heat transfer assembly can function effectively when mounted in any direction. Thermocouples 42 are used to monitor the temperature and efficiency of the heat generating electronic device 15 such that corrective action can be initiated if the device begins to overheat.

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Plano, TX, United States of America

Shun-lung Chao