Nippondenso Co., Ltd.

Kabushiki Kaisha Toyota Chuo Kenkyusho

Aichi Steel Works, Ltd.

Shun-ichi Murasaki

Yoshinobu Honkura

Shoji Noda

Masataka Naito

Kazuo Higuchi

Kiyoshi Uchida

Akio Itoh

Haruhiko Inoue

Mikio Niimi

A thin film layered member having high heat dissipation efficiency is composed of at least two diamond layers and at least one interlayer. The diamond layers and the interlayer ape alternately laminated and the diamond layers form outer surfaces of the thin film layered member. When this member is applied to a heatsink or the like, thermal stress to an element mounted thereon can be reduced because of a laminated structure comprising an interlayer having a high coefficient of thermal expansion and diamond layers having a low coefficient of thermal expansion. Further, the interlayer includes a carbide forming metal, which reacts with carbon atoms constituting a diamond in a laminating process and to form a carbide at an interface between the interlayer and the diamond layer, thereby realizing strong bonding therebetween.

Thin film layered member

A humidity sensitive element, which comprises a sintered humidity sensitive resistor composed of 70 to 20 mole % of ZnFe.sub.2 O.sub.4 and 30 to 80 mole % of a member selected from the group consisting of SiO.sub.2 and MnO.sub.2 and can detect humidity as electrical signals due to the nature of the element that its electrical resistance varies with the change of the humidity to be detected.

Humidity sensitive element

Growing community of inventors

Nagoya, Japan

Shun-ichi Murasaki