Mitsui Minings & Melting Co., Ltd.

Shun Fukuzato

Kei Anai

A composition for forming a conductive film contains flat metal particles and a resin. The flat metal particles each have a metal oxide layer in the surface portion thereof. The flat metal particles have a ratio of the thickness of the metal oxide layer to the thickness of the flat metal particle of from 0.010 to 0.300. The thickness of the metal oxide layer is from 0.010 μm to 2.000 μm. In the method for manufacturing a conductive film, a composition for forming a conductive film is used, the composition containing flat metal particles and a resin. The composition for forming a conductive film is applied to a base material to form a coating film, and then the coating film is irradiated with light to sinter the coating film, thereby obtaining a conductive film. The flat metal particles each have a metal oxide layer in the surface portion thereof.

Conductive film formation composition and method for manufacturing conductive film

Provided is a method for manufacturing a conductive film, including forming a coating of a composition that contains conductivity-imparting particles and photo-sintering the coating, wherein, prior to the photo-sintering of the coating, the coating is compressed in the thickness direction thereof. It is preferable that the coating be compressed at a temperature at which a binding agent contained in the composition shows a storage modulus of 100 MPa or less. It is also preferable that the coating be compressed so that the compression rate in the thickness direction is from 25% to 80%. It is preferable that, in the photo-sintering step, the light irradiation be performed through irradiation with pulsed light.

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Ageo, Japan

Shun Fukuzato