Apple Inc.

Western Digital Technologies, Inc.

Shujun Tang

Scott Wallace Miller

Nicholas D Smyth

Matthew D Hill

Zachary W Birnbaum

Brian A Argyres

Hao Zheng

Lindsay M Alanen

Tzong-Shii Pan

Daniel T Nguyen

Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

Multi-camera mounting chassis

A damper arrangement may be used in a camera module that includes a first (e.g., stationary) and a second (e.g., dynamic) component. The second component may hold a lens such that the lens moves together with the second component. The damper arrangement may include an interface member that extends from the first or the second component to at least partially into a viscoelastic material within a volumetric space configured in the first component, the second component, or both. The interface member may include a mounting portion having a thickness and a viscoelastic material section, having a different thickness, that interacts with viscoelastic material to dampen motion of the second component, for example, during operation of a lens actuator to move the second component along an optical axis of the lens. The interface member may be a two-piece interface member, such as a pin soldered into a hole in a plate, for example.

Damper arrangement for actuator damping

A head stack assembly (HSA) for a disk drive includes an actuator body, at least one actuator arm extending from the actuator body, and a flexible printed circuit (FPC). The FPC includes first and second pluralities of electrically conductive FPC traces, each having a distal portion that terminates at a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminate flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. A width of at least one of the first plurality of FPC traces is greater than a width of at least one of the second plurality of FPC traces. The distal portion of at least one of the first plurality FPC traces includes a first opening therethrough, for example less than 1 mm from its corresponding FPC bond pad.

Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features

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Santa Cruz, CA, United States of America

Shujun Tang