Sekisui Chemical Co., Ltd.

Shujiro Sadanaga

Hiroaki Nakagawa

Yoshio Nishimura

Sayaka Wakioka

Akinobu Hayakawa

Munehiro Hatai

Carl Alvin Dilao

The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy &#x394;E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260&#xb0; C., and a reaction rate of 40% or less at 4 seconds at 260&#xb0; C., as determined by differential scanning calorimetry and Ozawa method.

Adhesive for mounting flip chip for use in a method for producing a semiconductor device

Method for manufacturing semiconductor device and adhesive for mounting flip chip

An adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in Fig.A wherein a viscosity at 5 rpm measured at 25&#xb0; C. using an E type viscometer is A1 (Pa&#xb7;s) and a viscosity at 0.5 rpm measured at 25&#xb0; C. using an E type viscometer is A2 (Pa&#xb7;s), the range including values on the solid lines but not including values on the dashed line, and a blending amount of the curing agent is 5 to 150 parts by weight and a blending amount of the inorganic filler is 60 to 400 parts by weight based on 100 parts by weight of the curable compound.

Adhesive for electronic components, and manufacturing method for semiconductor chip mount

Growing community of inventors

Osaka, Japan

Shujiro Sadanaga