Kokusai Electric Co., Ltd.

Shuji Yonemitsu

Kazuhito Ikeda

Yukinori Aburatani

Yuji Yoshida

Takeshi Sugimoto

Hisashi Yoshida

Toshikazu Karino

Shinichiro Watahiki

Hideo Shimura

Tomoshi Taniyama

Hideki Kaihotsu

Yoshikatsu Kanamori

A substrate processing apparatus comprises a substrate transfer chamber; a substrate processing chamber disposed on a first side wall of the substrate transfer chamber; an intermediate substrate holding chamber disposed on a second side wall of the substrate transfer chamber; a first substrate holder disposed within the intermediate substrate holding chamber; a second substrate holder disposed within the substrate processing chamber; a first substrate transfer robot, disposed within the substrate transfer chamber, for transferring the substrate between the substrate processing chamber and the intermediate substrate holding chamber; a first gate valve disposed between the substrate processing chamber and the substrate transfer chamber; a second gate valve disposed between the substrate transfer chamber and the intermediate substrate holding chamber; an atmospheric pressure section located opposite to the substrate transfer chamber with respect to the intermediate substrate holding chamber; a third valve disposed between the intermediate substrate holding chamber and the atmospheric pressure section; a cassette holder disposed within the atmospheric pressure section; and a second substrate transfer robot disposed within the atmospheric pressure section, for transferring the substrate between a cassette held in the cassette holder and the intermediate substrate holding chamber.

Substrate transferring mechanism

Substrate processing apparatus with a processing chamber, transfer

A substrate processing apparatus comprises a substrate transfer chamber; a plurality of substrate processing chambers disposed on a first side wall of the substrate transfer chamber and stacked in the vertical direction; a plurality of first gate valves, each being disposed between each of the substrate processing chambers and the substrate transfer chamber; a substrate accommodating chamber disposed on a second side wall of the substrate transfer chamber; a substrate transfer device, disposed within the substrate transfer chamber, for transferring the substrate under reduced pressure between the substrate processing chambers and the substrate accommodating chamber; an elevator disposed outside the substrate transfer chamber and comprising a stationary portion and an elevating portion which is vertically movable with respect to the stationary portion; a rigid connecting member capable of moving through a through-hole formed in a predetermined face of the substrate transfer chamber, the rigid connecting member mechanically connecting the elevating portion and the substrate transfer device through the through-hole; and a sealing member for establishing a hermetic vacuum seal between the predetermined surface and the connecting member which penetrates through the through-hole.

Substrate processing apparatus

A thermal treatment furnace for use with a semiconductor system is provided. The thermal treatment furnace includes a scavenger which sealingly encloses a lower end of a reaction tube so as to diminish gas leakage from the reaction tube.

Thermal treatment furnace in a system for manufacturing semiconductors

Growing community of inventors

Tokyo, Japan

Shuji Yonemitsu